Meet a Pair of ASRock Motherboards with Support for AMD AMP2400+ MHz

ASRock is proud to announce that its two motherboard models are the first in the market to receive AMD AMP 2400+ MHz support, verified by a corresponding certificate. Hence, the FM2A88X Extreme 6+ and the FM2A88X-ITX+ are now officially optimized for an enhanced overclocking of memory modules via dedicated menu sections in UEFI BIOS. Moreover, the manufacturer promises to ‘endow’ the rest of FM2+ line with the support for a new memory standard.



Both greenhorns are based on AMD A88X chipset and are compatible with AMD A processors for Socket FM2+ platform. Along with the similarities, the models have a lot of distinctive features, described below.


ASRock FM2A88X Extreme6+ features the following specs:

— form-factor: ATX;

— VRM: 8+2 phases;

— expansion slots: two PCIe 3.0 x16, two PCI, two PCIe 2.0 x1, one PCIe 2.0 x16;

— memory: four DIMM slots, two-channel DDR3 modules, AMP2400+ MHz support, maximal capacity – 64 GB;

— storage: seven SATA …

Deepcool Introduces a Universal IceEdge 400 E CPU Cooler

Deepcool Industries, a well-known Chinese designer of multifarious cooling solutions, is going to launch its newest universal CPU cooler, entitled IceEdge 400 E (Elite Edition). The new-comer has got a tower-type design and features 100x86x125.5 mm dimensions.


This model is predestined to be incorporated into all contemporary platforms, including Intel’s LGA775/1150/1155/1156 and AMD’s 754/939/940/FM1/FM2/AM2(+)/AM3(+). Moreover, it is able to cool down rather hot processors, which TDP level reaches 130 W.


Deepcool IceEdge 400 E consists of a heatsink block, featuring thin aluminum plates, four copper heatpipes that support direct contact technology, and a single 92 mm fan. The latter is based on a fluid bearing and develops speed up to 2200 RPM. The maximal noise level it is producing approximates 26 dB. The fan is fixed due to wire spikes.


Pricing and release date are still unknown.

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Dell Inc. Latitude D620 based on Dell Inc. 0KX350

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