Welcome in a New Mid-Tower GT-A Chassis from Aerocool

Aerocool Advanced Technologies, an award-winning hardware manufacturer from Taiwan, is glad to announce the replenishment to the GT series, launching Aerocool GT-A — a budgetary mid-tower chassis. The model features 475x185x485 mm dimensions and is housed in a zinc-coated steel SECC case. Moreover, potential customers might revel in both, Black Edition and White Edition case versions. Retail price set by the manufacturer makes up 66 EUR.



Aerocool GT-A is targeting saving gamers with particular demands towards the chassis design. Hence, it boasts a non-trivial design with perforated frontal panel, a large side-panel acrylic window, as well as a dedicated dock-station for 2.5/3.5-inch drives. The layout is characterized by the support for ATX, micro-ATX and mini-ITX motherboards, the availability of three 5.25-inch drive bays (external), a triplet of 3.5 inch internal drive bays and identical number of 2.5-inch drive bays.


Expansion facilities are introduced by seven slots …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …

Lifting the Veil from USB Type-C Bus

Since the launch in 1995, Universal Serial Bus (USB) has proved itself as the most successful ever computing interface. Nowadays tens of billions of electronic devices are connected together due to it. It goes without saying that this bus has outlived a few modifications, each distinguished by higher speed and reliability. Thus, today the community is able to revel in a completely new modification – USB Type-C – that forecasts a lot privileges of connectivity process. Let’s see what users will get with a new bus.



Layout and Connectivity


In physical terms, Type-C is a bit larger than USB 2.0 Micro-B but a bit tinier than binary USB 3.0 Micro-B, featuring 8.34x2.56 mm. Such dimensions enable its connection to the devices of any type, including the thinnest smartphones/tablets. The oval-shaped socket houses 24 contact outputs (to compare: USB 3.0 sockets feature only 9 outputs).


The most outstanding physical peculiarity of Type-C is a symmetric connector that …
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Biometric devices, list of vendors

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