Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Lenovo ThinkPad LT3053p: Monitor with a Protection Shell



Lenovo is going to launch an unusual PC monitor, codenamed ThinkPad LT3053p. It wouldn’t be so unusual if it had standard construction, but the manufacturer decided to equip the case with a dedicated protection shell. This shell protects the screen from third-party light engines which can deteriorate or distort the imaging. Thus, the product is to catch fancy of professional users who require accurate imaging and color rendering.


ThinkPad LT3053p is a 30-inch display with 2560x1600 pixels resolution. The monitor is based on AH-IPS array type that ensures all outstanding viewing facilities: the maximal number of displayed colors – 1.07 billion, response time – 6 ms, viewing angles – 178/178 both across and down, the maximal brightness level – 350 cd/m2, static contrast – 1000:1. Moreover, the implementation of an advanced array resulted in 100% sRGB and 99% AdobeRGB color environment sweep.


I/O panel is represented by three USB 3.0 ports, two USB 2.0 ports, …

Company XFX is preparing Radeon HD 7970 GE with Double Dissipation cooler

American vendor XFX is about two weeks to release a Radeon 7970 Edition Double Dissipation (model code — FX-797G-TDF). It combines the capabilities of GPU Tahiti XT2 with a higher overclocking potential and the TDP, rather than at Tahiti XT, PCB reference design, but without a single phase power supply (6 +1), and the cooling system in the vaporizing chamber, an array of aluminum fins, PA plate (the same heatsink for the VRM and memory), as well as the two fans standard size 90 mm.



New model will get the recommended for the Radeon HD 7970 GE frequency ratio 1000/6000 MHz for core and chips GDDR5. The graphics chip will operate at 1050 MHz in the load. Recall that the “usual” HD 7970 was limited to regular frequencies 925/5500 MHz and did not support dynamic overclocking.


The configuration of video outputs is almost standard: from the five of DVI-I, DVI-D, HDMI and 2x Mini DisplayPort for some reason excluded DVI-D. The additional power is supplied by one 8-pin and one …
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Dell Inc. Dimension 9100 based on Dell Inc. 0X8582

  • ADAPTADORES DE PANTALLA
  • ADAPTADORES DE RED
  • CONTROLADORAS DE BUS SERIE UNIVERSAL (USB)
  • CONTROLADORAS IDE ATA/ATAPI
  • CONTROLADORES DE DISQUETE
  • DISPOSITIVOS DE IMÁGENES
  • DISPOSITIVOS DE INTERFAZ DE USUARIO (HID)
  • DISPOSITIVOS DE SISTEMA
  • DISPOSITIVOS DE SONIDO, VÍDEO Y JUEGOS
  • EQUIPO
  • MOUSE Y OTROS DISPOSITIVOS SEÑALADORES
  • PROCESADORES
  • TECLADOS
  • UNIDADES DE DISCO
  • UNIDADES DE DISQUETE
  • UNIDADES DE DVD/CD-ROM
  • VOLÚMENES DE ALMACENAMIENTO