MSI Releases an Affordable Motherboard of Micro-ATX Form-Factor

Right after the release of FM2-A75MA-P33 motherboard, MSI has taken a decision to design one more model for AMD Trinity platform. Codenamed MSI FM2-A85XMA-E35, a new model is based on a more efficient chipset – AMD A85X. This motherboard is a typical representative of entry-level solutions, though can boast a number of attractive facilities.



MSI FM2-A85XMA-E35 is developed in micro-ATX form-factor for Socket FM2 CPU sockets. The model is known to support AMD A and Athlon II processors. This board accommodates two DIMM slots for the installation of DDR3 memory modules, the overall volume of which can rise up to 32GB. The supported memory operating frequencies might vary: DDR3-1066 MHz, 1333MHz, 1600 MHz, 1866 MHz, and 2133 MHz. Power subsystem features a rather unpretentious framework and consists of five phases; thus, this model isn't intended for overclocking purposes.


Expansion facilities implemented in MSI FM2-A85XMA-E35 can be found in any other entry-level …

Telum and Ferrum: the Continuators of Aerocool Templarius Genus

Aerocool proudly introduces two new PC cases that have been entitled as Templarius Telum and Templarius Ferrum. As seen from the titles, the novices continue Aerocool's Templarius chassis line and are called to become their worthy representatives. Both models are appropriate for the mounting of gaming computers and other powerful systems. Moreover, they are already on sale, so gamers and other enthusiasts can taste all their benefits in real time.



PC cases Telum and Ferrum are developed in full-tower ATX form-factor. Their dimensions, 420x185x435 mm and 460x200x455 mm correspondingly, promote for the installation of truly voluminous and mighty components: CPU coolers up to 158 mm in height and graphics adapters up to 400 mm in length. Internal framework allows the user to create a really efficient cooling environment, providing room for up to ten fans. Besides, the chassis are equipped with dedicated holes for the water-cooling organization; all tubes and a heatsink can be …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Dell Inc. OptiPlex GX520 based on Dell Inc. 0WG233

  • CDROM
  • COMPUTER
  • DISKDRIVE
  • DISPLAY
  • HDC
  • HIDCLASS
  • KEYBOARD
  • MEDIA
  • MOUSE
  • NET
  • PORTS
  • PROCESSOR
  • SYSTEM
  • USB
  • VOLUME