Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …

D-Link Introduces New Storage Area Network Series DSN-6000

D-Link, a world-known manufacturer of network and telecommunications solutions, has officially introduced its two SAN models which are unified into a single series DSN-6000 iSCSI. The prime destination of this SAN series is to satisfy the needs of small and medium-sized business and to provide effective solutions of any emerging demands. DSN-6000 is characterized by the improved efficiency and performance index, as compared to the previous model lineups, on operation in virtual and physical environment.



The series is represented by two models: DSN-6410 iSCSI and DSN-6110 iSCSI. The both models go with the casing designed in 2U form factor, and is intended to be installed into a typical server frame. The models are equipped with twelve bays for drives and SAS interface. The cumulative volume capacity of the bays approximates to 36 Tb. DSN-6410 iSCSI is furnished with a couple of 10 Gigabit Ethernet ports, while the DSN-6110 iSCSI model accommodates four Gigabit Ethernet ports.

CPU Cooler Deepcool Ice Blade Pro v2.0 Review

Deepcool can be boldly attributed to the manufacturers that are constantly improving their mastery is the elaboration of hardware components. The company’s second revision of CPU cooler Ice Blade Pro is a bright confirmation of this statement. Codenamed Ice Blade Pro v2.0, this product is supposed to exceed its predecessor in performance, noise level and consumer appeal. But let’s start its reviewing from technical peculiarities.



Technical Peculiarities


Deepcool Ice Blade Pro v2.0 features the following specifications:

— dimensions: 161x125x70 mm (+fan(s) 120 mm), ultimate weight – 981 g;

— compatibility: Intel Socket LGA 2011/1366/1156/1155/775, AMD Socket 939/FM1/FM2/AM2/AM2+/AM3/AM3+;

— heatsink: tower framework consists of 49 aluminum plates, 4 heatpipes and a base supporting Core Touch technology;

— fan: dimensions — 120x120x25 mm, type of bearing – fluid-film bearing, nominal/startup fan voltage – 12/7 V, maximal power consumption – …
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Acer, inc. Aspire 5050 based on Acer, Inc. Prespa M

  • BATTERY
  • COMPUTER
  • DISKDRIVE
  • DISPLAY
  • HDC
  • KEYBOARD
  • MEDIA
  • MODEM
  • MOUSE
  • NET
  • PCMCIA
  • PROCESSOR
  • SCSIADAPTER
  • SDHOST
  • SYSTEM
  • USB
  • VOLUME