Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

ECS Develops Haswell-Compatible Motherboard Z87H3-A2X Extreme

At the cusp of an official release of Intel’s fourth generation processors each hardware designer tries to elaborate new Haswell-compatible components. Motherboard manufacturers are probably the ones to introduce the lion’s share of such products. ECS is not an exception. According to the data provided by a reputable source, ECS is soon going to release its newest prime-class board codenamed Z87H3-A2X Extreme. The first meeting with the new-comer is planned within the boundaries of Computex 2013 exhibition taking place in June.



As seen from the codename, ECS Z87H3-A2X Extreme is based on Intel Z87 Express chipset covered by a black-and-red heatsink. The model employs full-sized printed circuit board, Socket LGA1150, and 12-phase VRM for CPU power supply with gold-plate solid-state capacitors. Power subsystem elements are cooled down by a voluminous CoolTech V heatsink. This heatsink is connected with a chipset one by means of a nickel-plated copper heat pipe.


To …

Liquid-Cooling System Zalman LQ315 Review

A few months after the last release of water-cooling systems, Zalman introduces a new series of products with a title attribute LQ3xx. The series consists of three models, LQ320, LQ315 and LQ310, which differentiate themselves primarily by dimensions. The senior cooler (LQ320) features 32 mm water block and 52 mm heatsink, the medium LQ315 cooler features 38 mm heatsink and analogous in dimensions water block; the junior cooler (LQ310) is the tiniest one and features 28 mm heatsink and water block. Zalman LQ315 greatly resembles its predecessor, CNPS20LQ, in design, however, is ready to offer some improved options, if compared with the previous cooler generations.



Design and Framework


Like any other water-cooling system, Zalman LQ315 consists of a water block combined with a pump and joined with a heatsink by means of flexible tubes. The water block is notable by the availability of 'Z' logo on its surface that is lighted blue during operation. Its round base, made of …
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