High-end graphics cards segment is represented by a line of outstanding, catchy and inspiring products. Each manufacturer tries to add some unique traits to its creation with the aim to engage as many customers. Nominal model GeForce GTX 670 has become a reliable base for many graphics cards. Nevertheless, Inno3D implemented in this base an advanced cooling system with a bright name iChill HerculeZ. Still, this is not the only attractive feature, since the card is able to offer a number of other unmatched options.



Design and Integration


Design is what singles out Inno3D iChill GeForce GTX 670 HerculeZ 3000 from other graphics cards in high-end segment. Its voluminous cooling system that consists of three large fans, its height that equals to three expansion slots, and its ornamental metallic elements with huge screws speak of grandeur and reliability. The overall length of the card achieves 29 cm. Large heatsink covers all basic components of the printed circuit board. The …

Commercial success of the company in IT market depends upon the applied marketing strategies, line of products, and processing technologies. OCZ Technology belongs to the businesses that implement all the above mentioned aspect in their expertise. This allows the company to establish good reputation in SSD segment and win its constant customers. Their lines of products are continually replenishing with the new advanced devices targeted at clients with different needs and financial possibilities. OCZ Petrol series can be attributed to the budgetary products with good performance and good price.



Design and Framework


First of all, it should be mentioned that OCZ Petrol is represented by only two versions with 64 GB and 128 GB volume capacities. Both models are delivered in a standard format with minimum components in the nominal kit. Design of the casing is developed according to the company's prime standards: the lower part is made of metal, while the top of the casing is …

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …