LEPA NEOllusion CPU Cooler with an extraordinary LED backlighting

For the first time the LEPA NEOllusion CPU Cooler was demonstrated during the Computex 2016 exhibition. And the WOW moment is in its unique backlighting: LEDs are located not on the fan, but on the sides of the construction. Besides, their colour and work mode can be modified with the help of the control unit, which can be attached to the metal framework by magnetically charged legs.



The LEPA NEOllusion cooling system features the base, four 6 mm copper heat pipes with a direct contact to the CPU heat dissipation lid, the aluminum radiator and the 120 mm fan (its rotative speed range is 600–1800 rpm or 400–1000 rpm with a set adapter). With the special blades shape and excellent aerodynamic qualities it can pump the air flow of up to 128.12 m3/hr (up to 78.31 m3/hr with an adapter) at the static pressure of 2.41 mm H2O (0.9 mm H2O) and the noise grade of 33 dBA (19 dBA).


LEPA NEOllusion dimensions are 161.7 х 126 х 40 mm, and its weight is 645 g. It is compatible with …

Meet a Pair of High-Efficiency M6 and M.2 SSDs from Plextor

Plextor, an established data storage manufacturer from Japan, announces the release of two new solid-state drive series – the M6 and the M.2. Both new-comers are marked by some outstanding efficiency facilities and completely new design. The M6 SSDs are developed in 2.5-inch design but are housed in ultrathin aluminum cases of 5 mm depth only. They are based on Marvell 88SS9187 controller and MLC NAND flash-memory of Toggle type (19 nm technological process).



The M6 drives feature high-speed SATA III 6 Gb/sec interface and support Plextor TrueSpeed technology. It should be noted that these SSDs are thought to support up to 1 GB RAM – DDR2-800 or DDR3-800 — used as cache. With the attempt to satisfy the needs of diverse customer audiences, Plextor is going to release the M6 modifications: M6 Pro models for high-performance tasks and M6S for ordinary users.


To continue, the M.2 solid-state drives are designed in a totally new NGFF form-factor (New Generation Form …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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