PowerColor Intros New Graphics Card with Fling Force Cooler

TUL Corporation, in the framework of its PowerColor brand, introduces a new graphics card with quite an original way of air cooling organization. The new-coming adapter, codenamed PowerColor Radeon HD 7850 Fling Force, employs 'two-storied' cooler of an unusual structure. Along with an aluminum heatsink, copper heat pipes, and a voluminous fan, the manufacturer implemented non-monolithic fan ribs. Their tips are fixed to the main part in a way to change their location relative to the plain of rotation.



On conditions of low rotational speed, tips of the ribs are located at approximately 80 degrees angle relative to the graphics card. On conditions of heightened speed, the ribs become more linear; this way, the impeller diameter enlarges from 92 mm to 95 mm. Such structural approach to the fan framework develops into an improved performance and air cooling effect.


The model is based on Pitcairn chip, developed on Graphics Core Next architecture under 28 nm technological …

PowerColor Outs an Overclocked Radeon R9 270 OC Graphics Card

Along with other AMD partners, PowerColor has elaborated its own version of Radeon R9 270 adapter. The PowerColor Radeon R9 270 OC is differentiated from rival products by an improved cooling system and factory overclocked frequencies. Its release is scheduled for late November and the retail price won’t hit over $180.



To begin with, this graphics card is naturally based on AMD Curacao Pro GPU, developed under 28 nm technological process. It consists of 1280 current processors, 32 ROPs and 64 TMUs. The core runs at 930 MHz frequency and is able to gain 955 MHz frequency on overclocking. The incorporation of GDDR5 memory (2 GB) with 256-bit bus interface ensures some striking bandwidth of 180 Gb/sec; this provides for the support of gaming applications with high resolution. Memory chip operates at 1400 MHz nominal frequency but might gain the index of 5600 MHz of effective frequency on overclocking.


Cooling system, implemented within Radeon R9 270 OC, cannot be called …

AMD Announces the Development of Steamroller

Heightened demand for high-end processor solutions and ever rising competition make AMD constantly develop its products. This usually results in the release of really outstanding items, such as already acknowledged Bulldozer and Piledriver. Therefore, according to the words of the companies technical manager, Mark Papermaster, the development of a new processor architecture, codenamed Steamroller, is already on order of AMD's business. The ready-made products are sure to be released next year. Steamroller is called to become the third edition of Bulldozer architecture that launched last year and a loyal companion of Piledriver core.



The initial data witness that processors on Steamroller architecture will be designed in correspondence with 28 nm technological process. This should favorably affect their efficiency and enlarge the performance by 15-20% at equivalent power consumption and clock frequency. At the same time, Steamroller will improve all specifications implemented in …
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Memory card devices, list of vendors

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