Xigmatek is on the Threshold to Release a New Gaming Chassis

Xigmatek is preparing a pleasant surprise for all gamers: a new unusual PC chassis, codenamed Talon. Talon will head the company's brand new chassis line – Stealth Series – and will offer some outstanding solutions. Xigmatek developers are ascertained that this model will totally satisfy the needs of any gamer, due to the availability of game-like facilities and racy design.



Xigmatek Talon is developed in Mid-Tower form-factor, according to the classical design guidelines with a light hint of aggression. The frontal panel features a salient surface to mark its particular gaming predestination. One of the side panels contains an acrylic window that serves a kind of exhibition stand, unveiling all internal components. The top lid, along with a frontal panel, is finished by a rubbered coverage with 'soft-touch' effect. Metallic plates of chassis are painted black. The top panel accommodates a couple of USB 3.0 ports and some other input/output interfaces.


The new chassis …

Stylish CPU Cooler Ice Hammer IH-4800 Review

Cooling solutions under Ice Hammer brand enter the market not so frequently as wished it to be. Still, the company manages to gladden all potential customers with high-quality products. This time, in close cooperation with Thermalright, it launched IH-4800 CPU cooler that is a modified version of True Spirit 140 model. Yet, what kind of options are going to attract the audience? Let’s find it out.



Heatsink and Fan Framework


The employed by the IH-4800 heatsink features 155x55x170 mm dimensions. It is a typical single-section tower, accompanied by six U-shape heatpipes. The pipes did not get nickel-plated coating, so they have a highly polished copper design. The heatsink embraces fifty aluminum ribs with 2 mm distance from each other.


The ribs are connected with the pipes by means of a dedicated neck finish with a thorough soldering. Six lower ribs do not have contact with two heatpipes, since the latter got a strongly pronounced curve at the output. The heatsink …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.



New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.


Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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