Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

First SSDs from Asus to be Released Already in May

First seen at CES 2013 exhibition, Asus ROG RAIDR solid-state drives are on their final stage of development before an official release in May. Unlike the majority of contemporary SSD solutions in the market, the product from Asus features quite distinct form-factor, similar to expansion cards. The new drive is known to employ PCI Express 2.0 x2 interface with the support of x16/x8/x4 slots.



According to the preliminary data, ROG RAIDR solid-state drives will be available in two capacity variations – 120 GB and 240 GB. Both models will run under a couple of SandForce SF2281 controllers, comprised into RAID 0 array. MLC NAND flash-memory chips from Toshiba (designed under 19 nm technological process) will be the heart of revolutionary SSDs. Irrespective of the overall differentiation, ROG RAIDR will support a range of technologies traditional SSDs support, including S.M.A.R.T., TRIM and NCQ.


With the respect to the performance, both drives will be able to demonstrate …

Uncompromised PC Chassis AeroCool DS Cube Review

The Dead Silence (hereinafter DS) chassis series, developed by AeroCool, now boasts a really offbeat representative: the DS Cube. It is primarily famous for an unusual form-factor. This is not a mini-tower, since its compact exterior does not match spacious interior, ready to house full-format components. The other peculiar feature pertained to the model is a decreased noise level. Altogether, the final user receives an uncompromised PC chassis with a stylish design and contemporary layout. Let’s see what other facilities this ‘Cube’ might offer.



Basic Specifications


AeroCool DS Cube features the following specifications:

— dimensions: 411x265x391 mm, weight – 7 kg;

— chassis: cover – steel/plastic, side window (optional), detachable top panel, color variations – red, black, black-and-white, white, orange, and gold-shinning;

— supported motherboard formats: mini-ITX, micro-ATX;

— number of supported expansion cards: 4;

— storage: 1x …
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Dell Inc. OptiPlex GX520 based on Dell Inc. 0WG233

  • CDROM
  • COMPUTER
  • DISKDRIVE
  • DISPLAY
  • FDC
  • FLOPPYDISK
  • HDC
  • HIDCLASS
  • KEYBOARD
  • MEDIA
  • MODEM
  • MOUSE
  • NET
  • PORTS
  • PROCESSOR
  • SYSTEM
  • UNKNOWN
  • USB
  • VOLUME