Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Thermaltake Unveils Extraordinary Core G3 PC Chassis

Thermaltake decided to gladden its fans with the release of an offbeat chassis – the Core G3. The new-comer is differentiated by a slim profile (454x371x140 mm); however, it might be used for the fitting of various gaming configurations. Despite Slim Tower framework, the model is able to accommodate motherboards of full ATX form-factor with two expansion slots.



Thermaltake Core G3 might be employed as vertically so horizontally. Inner space is sufficient for the integration of 310-mm long graphics cards, SFX power supply units as well as 110-mm high CPU coolers. Besides, the availability of PCI Express riser allows for the mounting of the videocard in dual positions: parallel or perpendicular to the motherboard.


In order to enhance cooling performance, the user is free to integrate a liquid cooling system with a 240-mm heatsink. Initially, the chassis is furnished with two frontal 120-mm fans; one more 120-mm fan can be installed on the top facet. All cooling slots are …

ECS Develops Haswell-Compatible Motherboard Z87H3-A2X Extreme

At the cusp of an official release of Intel’s fourth generation processors each hardware designer tries to elaborate new Haswell-compatible components. Motherboard manufacturers are probably the ones to introduce the lion’s share of such products. ECS is not an exception. According to the data provided by a reputable source, ECS is soon going to release its newest prime-class board codenamed Z87H3-A2X Extreme. The first meeting with the new-comer is planned within the boundaries of Computex 2013 exhibition taking place in June.



As seen from the codename, ECS Z87H3-A2X Extreme is based on Intel Z87 Express chipset covered by a black-and-red heatsink. The model employs full-sized printed circuit board, Socket LGA1150, and 12-phase VRM for CPU power supply with gold-plate solid-state capacitors. Power subsystem elements are cooled down by a voluminous CoolTech V heatsink. This heatsink is connected with a chipset one by means of a nickel-plated copper heat pipe.


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Dell Computer Corporation OptiPlex GX270 based on Dell Computer Corp. 0U1325

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