Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Seven-Port USB 3.0 Hub H7988-U3 from Orico

Chinese company Orico has just voiced good news for all people craving for a comprehensive device which enables numerous USB 3.0 connections. Its new seven-port hub H7988-U3 is able to satisfy the needs of any customer who feels the need for several simultaneous USB 3.0 connections. This is not the first Orico's attempt to produce a really multi-functional device. The company has recently introduced PC expansion chip with PCI Express x1 interface which involved seven ports as well. Analogous functionality has been implemented in a new external hub H7988-U3.



Orico H7988-U3 goes in two color variants (black and white) and is based on VIA VL801 controller. The framework of the hub is rather suitable for the multi-connection operations. All available USB 3.0 ports are located on the side plates: three ports on the frontal plate, and two in each side plates. The rear plate accommodates the switch, USB 3.0 port to be connected with PC, and input to be connected with the power network …

Eizo Announces a New PC Monitor with 4:3 Aspect Ratio

Eizo Nanao Corporation, a Japanese innovator in the field of display design, has just announced the release of its new PC monitor, codenamed FlexScan S2133-H. The model features 21.3 inch display with 1600x1200 resolution, and nearly foursquare 4:3 aspect ratio. Based on IPS array with a power-saving LED backlit, this monitor is primarily targeting corporate and industrial users.



Monitor FlexScan S2133-H is notable by mat screen coverage and the availability of light sensor which allows adjusting the brightness in automatic mode, due to the support of Auto EcoView option. In free sale this model will be delivered in two color variations – white and black – and will be sustained by a 5-year’s limited warranty.


An advanced IPS panel ensures the most ‘true-to-life’ imaging and high-quality video effects. Therefore, the maximal brightness claimed for this model equals to 420 cd/m2, array response time equals to 6 ms, viewing angles achieve the index of 178/178 …
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