Meet New High-Speed External Hard Drive Buffalo HD-GDU3

Buffalo Technology, a Japanese manufacturer of all innovatory storage devices and network solutions, showcases a new external hard drive, codenamed HD-GDU3, within the boundaries of DriveStation series. The new drive is housed in a black casing, featuring 45x126x202 mm dimensions. The model is known to have three capacity variations and, correspondingly, three different models: HD-GD1.0U3 (1TB), HD-GD2.0U3 (2TB) and HD-GD3.0U3 (3TB).



These external drives employ 3.5-inch hard drives as the basis and support an advanced high-speed USB 3.0 interface. Their layout involves 1GB of DRAM cache-memory which utilizes a dedicated caching software applet Turbo PC EX2, delivered along with the drives. This applet is called to immensely accelerate the data transfer process. The nominal delivery kit also includes a large software package with encoding and backup programs.


According to Buffalo developers, their HD-GDU3 is the fastest external hard drive ever seen. Thus, the maximal …

Cougar Intros Power-Saving PSU Series GX-S

Cougar has recently introduced a new power-saving PSU series codenamed GX-S. The series includes three high-efficiency models which meet the requirements of 80Plus Gold standard: GX-S 400W, GX-S 500W and GX-S 600W. Cougar promises that the products will be available in free sale already in early April. All three PSUs are housed in a black casing with golden logo and accommodate high-quality Japanese capacitors that ensure utmost performance and reliability.



Cougar GX-S series employs LLC technologies which are called to reduce the power loss on Off/On activities. The models also feature a power-saving framework to comply with Eco-Friendly EuP, ErP Lot6 and Energy Star 5.0 standards. Hence, the units consume less than 0.9W in ‘Off’ mode. Besides, GX-S units absolutely meet ATX12V specifications, support all novel (and future!) platforms on the basis of multi-core processors, as well as several graphics adapters with PCI-e 2.0 interface and 8-pin PCI-e connectors.


All …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Dell Inc. Latitude D620 based on Dell Inc. 0KX350

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