Power Supply Unit Huntkey GS550 Review

Huntkey Enterprise Group is a comparatively new player in the global PSU market. However, its products are already well-known to the mainstream customers in different corners of the world. GS series is the one to compete with an army of items from acclaimed manufacturers, featuring so far only two models: GS450 and GS550. Giving names to the models, Huntkey applied a popular marketing approach, where the figure index in the codename exceeds actual wattage index of the unit. Thus, GS550 model is estimated actually for 450 W power. What other surprises are hidden in this model? Let’s find out.



Key Specifications


Power supply unit Huntkey GS550 is housed in a solid case, made of a thick dark-gray steel with a wiry ventilation grid. All basic specifications are marked on the sticker, so that the user can easily integrate it within the system. The +12VDC rail is claimed to provide 384 W power at 32 A current. The interrelation of power on this rail with an overall efficiency …

Scythe SCIOR-1000: a Comprehensive CPU Cooler with Top-Flow Design

Scythe is going to start the sales of its newest CPU cooler, entitled SCIOR-1000. It is honored for a comprehensive nature, since it might work with all contemporary CPUs, except for Intel Socket LGA2011 models. The other remarkable thing ascribed to the product is the employment of Top-Flow design.



Therein, the fan is localized over the heatsink, directing the airflow towards the whole framework, including the nickel-plated base. This way, it promotes for a better cooling effect.


Scythe SCIOR-1000 embraces also three 6 mm heat-pipes, along with a 100 mm fan. The latter supports PWM technology, so is able to reach the speed of 1800 RPM. The maximal noise level achieves 26.7 dB. Release date is scheduled for the final days of 2013. Some other specifications about the cooler are described below:

— framework dimensions: 136x117x107 mm, weight – 400 g.;

— supported platforms: Intel – LGA1366/115x/775 and AMD – FM1/FM2/AM2/AM2+/AM3/AM3+;

— heat-pipes: …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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