New characteristics of co-processors Xeon Phi

For several years, developed Intel Larrabee graphics cards have changed its destiny, and now proudly referred to coprocessors Xeon Phi. The June announcement gave a very rough idea of ​​their characteristics and applications (highly specialized servers and workstations). Now some details will be revealed.



Bboosters Xeon Phi will be available in versions with 57, 60 and 61 core. There are in general 64 computational units, but some of them will be disabled. Depending on the number of cores the cache size varies from 1.8-1.9 MB first level and 28-30,5 MB second. The volume of onboard GDDR5 memory is 3, 6, and 8 GB.


Intel Xeon Phi device will operate on a low clock rate from 600-1100 MHz for the lower 57-core models with 3 and 6 GB of GDDR5, to the 630-1050 MHz or more for the older 60 — and 61-core board with 8 GB of RAM. Effective memory frequency will be in the range of 5-5.5 GHz. Support for dynamic overclocking Turbo Boost will be provided by reasonable balance of …

Antec Replenishes High Current Gamer M Series with Two New PSUs

Antec decided to expand its renowned High Current Gamer M series of power supply units with two new models. Codenamed HCG-750M and HCG-850M, the units are characterized by modular cable connectivity and rather high level of efficiency (up to 81% in 230V networks). Not for nothing this couple is honored by 80Plus Bronze certificate that vindicates their prime-quality. It must be noted that existent internal framework is totally the work of Seasonic, Antec’s contractor.



Both new-comers are equipped with four PCI Express Power (6+2)-pin cables and support 10/12/14/16-contact power sockets. The layout consists of two virtual +12V rails, Active PFC mechanism, and high-class Japanese capacitors. HCG-750M allows for the maximal loading on +12V rail of 62A at 744W, whereas HCG-850M allows a bit higher loading of 70A at 840W.


With the purpose to prolong the units’ lifetime, Antec furnished the models with all up-dated security functions, featuring: UVP (low voltage protection), …

Micron to Carry Out the Production of TLC Memory Next Year

Memory market, similar to other industries, undergoes certain changes and updates from time to time. Therefore, memory manufacturers are currently trying to comply their production with two major tendencies: considerable drop in demand for RAM, employed basically in desktop PCs, and simultaneous growth of demand for solid-state drives, employed in compact tablets and mobile devices. Besides, the latter is developed at lightning speed.



Micron, one of the leading memory manufacturers, feels like no one else all the changes and fluctuations in the market. Its quarterly reports witness about the relentless drop in demand for DRAM (9% drop at average) for the report period. At the same time, increase in SSD segment is estimated at 5% at average. Sales volume of NOR memory type did not outlive serious changes.


According to the preliminary data, Micron is going to carry out the production of memory on TLC microchips, manufactured under 20 nm technological process. The assumed …
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