Geil has highlighted certain information about its new DDR3 memory series, codenamed Evo Veloce. According to the claimed by the manufacturer specifications, Evo Veloce will become a master sample for all similar DDR3 modules. This declaration is vindicated by the product's speed performance due to which the series will be of major interest to gamers and PC enthusiasts. The product has been primarily introduced within the measures of international exhibition Computex 2012, and is now officially presented at the Geil's website.



Evo Veloce series is represented by a range of two-channel and four-channel kits to suffice the needs of any customer. The main destination of these DDR3 modules is to be applied within platform systems on Intel X79/Z77 Express chips base. They are delivered with the integrated Maximum Thermal Conduction and Dissipation technology that stipulates the availability of dedicated fins of red or white colors. Those fins are predestined to ensure an effective …

New PC chassis from Cooler Master appear in the market with an enviable regularity. Each customer group, starting from entry-level customers and finishing with overclockers, can totally avail themselves with the up-dated facilities provided by the developer. This time, individuals with a quite modest budget will have an opportunity to enjoy all the privileges of contemporary technologies, since Cooler Master is going to release next month a new budgetary PC case of midi-tower form-factor. Codenamed CM Force 500, the case features 491.5x190.426 mm dimensions and is entirely painted black.



Chassis CM Force 500 supports motherboards of ATX and micro-ATX standard, and is ready to welcome all graphics adapters of up to 320 mm in length. Internal framework is estimated for the installation as of air cooling system, so of liquid coolers; hence, the maximal admissible height of the CPU air cooler approximates 164 mm, while dimensions of the heatsink attached to the liquid cooler should …

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …