Cooler Master Readies a New Silencio 452 PC Chassis

Cooler Master has added a new PC chassis to its Silencio series. The Silencio 452 is developed in a mid-tower form-factor and features 194x451.4x494.7 mm dimensions. It is peculiar by a sleek design with totally black interior and exterior. The case boasts soundproof side panels and anti-vibration rubber props. The greenhorn is supposed to come on sale in early January, 2014, though the pricing is currently unknown.



Cooler Master Silencio 452 is intended to accommodate motherboards of a standard ATX, as well as a micro-ATX standard. Storage is introduced by two 5.25-inch racks and six internal 3.5/2.5-inch racks. This is quite enough for the assembling of a powerful platform.


Internal layout allows for the installation of quite lengthy graphics adapters (up to 386 mm) and, if necessary, a voluminous liquid-cooling heatsink (240 mm). The latter is supplemented by dedicated rubber grommets on the rear facet.


Initially the chassis is furnished with a pair of low-noise …

Non-reference GTX 760 Graphics Adapter with S.A.C. Cooling from Elsa

Elsa, a well-known Japanese manufacturer of graphics solutions for PC systems, is going to release its own non-reference model of Nvidia GeForce GTX 760 adapter. Codenamed Elsa GeForce GTX 760 S.A.C., the card is based on an original PCB with PCI-e 3.0 x16 interface. The heart of the model is GK104-225 chip (an estimated performance equals to 2.3 GFLOPS), designed under 28 nm Kepler microarchitecture. It features 1152 CUDA cores, 32 ROPs, 96 TMUs, and runs at the nominal 980 MHz frequency (1033 MHz on overclocking).



Graphics card GTX 760 S.A.C. carries 2GB memory of GDDR5 type that is equipped with 256-bit bus and operates at 6008 MHz clock frequency (effective index). Power supply process is realized via two 6-pin sockets. It should be noted that this model is known to consume not more than 170 W power. The reverse side of PCB contains video interface panel with four outputs: DisplayPort, HDMI, Dual Link DVI-D, Dual Link DVI-I.


As it’s vivid from the codename, this …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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