SilverStone Heligon HE01 - a new super-cooler

The Taiwanese company introduced a bulky cooler SilverStone Heligon HE01, which is designed to cool down more or less all types of modern CPUs — from Intel LGA775 up to LGA2011 and from AMD AM2 to AMD AM3 + / FM2.



The construction does not weigh less than 1.1 kg, since in addition to two-part radiator (926 g) it is equipped with fan of 140x140x38 mm size. Linear dimensions of Heligon HE01 are 140 mm in width, 119 mm in length and 160 mm in height. Staples that hold the fan, take a few millimetres of space.


The thickness of a pair of «towers», joined by six nickel-plated copper heat pipes with a diameter of 6 mm, is uneven. The intense air flow passes successively through a thin array of aluminium fins, and then through the fan, afterwards through a larger section of the radiator. Copper base with nickel cover is protected with a film from scratches.


The manufacturer claims that Heligon HE01 will cope with the withdrawal of 300 watts of heating power.


Regular …

HIS Radeon R9 290 IceQ X2: Graphics Card with an Offbeat Cooler

HIS has recently replenished its Radeon R9 series of graphics cards with a new model – the Radeon R9 290 IceQ X2. Based on AMD Hawaii Pro chip, this card is a combination of an ultimate efficiency and an offbeat design. The integrated GPU runs at an etalon frequency — 947 MHz. No changes have been incorporated into the frequency mode of GDDR5 memory: the 4 GB memory with 512-bus interface runs at nominal/effective 1250/5000 MHz frequency.



The major peculiarity pertained to the model is the employment of a proprietary two-slot cooler, codenamed IceQ X2. It consists of a spacious copper base (40x47.5 mm), a large aluminum heatsink, a pair of 89 mm fans, and five nickel-plated heatpipes: 2x 8 mm and 3x 6 mm. The cooler also accommodates additional heatspreaders, which dissipate heat in memory and VRM sections. Moreover, the framework boasts a dedicated stiffening plate that reduces loading on the printed circuit board.


To continue, HIS Radeon R9 290 IceQ X2 comes with two …

Fractal Design Updates Its Core 1000 Chassis to USB 3.0 Version

Fractal Design, an outstanding Swedish PC cases developer, decided to update its mini-tower Core 1000 chassis model with the purpose to heighten its competitive power. Released in 2011, this case has not undergone major design renovations but its layout has been a bit modernized: the manufacturers integrated a single super-speed USB 3.0 port to provide for a better performance.



Codenamed Core 1000 USB 3.0, this chassis features 175x355x420 mm dimensions and supports mini-ITX/micro-ATX motherboards. It’s housed in a totally black, austere casing and has got a grid-like frontal panel with removable anti-dust filters. Internal layout is predestined to accommodate two 5.25-inch drive bays, two 3.5-inch HDD bays or three 2.5-inch SSD/HDD bays, four PCI expansion cards, CPU coolers of up to 148 mm in height, PSUs of up to 185 mm in length, as well as graphics cards of up to 350 mm in length (without HDD bay) or up to 210 mm in length with an installed HDD bay.


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