New Budgetary Chassis K380 from Cooler Master

Cooler Master announces the release of a new entry-level chassis K380 (RC-K380-KWN1). This model will replenish the K Series of products and will feature mid-tower parameters (209x445x479 mm overall dimensions). K380 is basically intended at gamers, due to an eye-catching design: the chassis is housed in a solid casing made of steel and plastic with some aggressive inclusions and details. However, the major distinctive peculiarity ascribed to the newbie is its moderate price that will not exceed the border of $80. Affordability affirms Cooler Master's image of the company that skillfully combines high-quality with alluring prices.



The chassis is painted black from the inside and outside and accommodates a metallic grid on the frontal panel. Its side panel is notable by the availability of a large transparent window that showcases internal layout. In its turn, internal spacing is sufficient to locate motherboards of ATX and micro-ATX form-factor, graphics cards of 316 mm in …

New Mini-PC Foxconn AT-5570 from NanoPC Series

Foxconn introduces a new high-performance mini-PC intended basically at home media systems. Codenamed AT-5570, this computer is characterized by power-efficient, low-noise and compact (190x135x38 mm) properties. Thanks to a dedicated VESA fixing element, AT-5570 might be placed on a rear plate of TV-set or PC monitor; this will offer additional space on the working surface. All potential clients will find this PC either in black or silver casing coloring.



Mini-PC Foxconn AT-5570 is based on two-core AMD C-70 processor and employs AMD Radeon HD 7290 graphics core. The implemented graphics differs dramatically in terms of speed from Intel GMA built-in solutions which are frequently used in similar compact PCs. The model supports DirectX 11 technology and uses DVI/HDMI ports as imaging output; the customer is able to connect two monitors simultaneously to provide for better graphics effects.


The integrated CPU is notable by 9W TDP index that positively influences the warming …

G.Skill Showcases New RAM Memory Modules TridentX DDR3

Long-awaited Computex 2013 has brought to light the whole galaxy of innovative hardware ideas. RAM market has also replenished with new entries, partially due to G.Skill International. Its new RAM modules, codenamed TridentX DDR3, are an embodiment of utmost performance, reliability and compatibility. The new-comers have been developed to support the latest Intel’s Haswell-based CPUs i3/i5/i7, integrated into Intel Z87 Express chipset.



TridentX DDR3 are introduced by sets of two and four 240-contact DIMM modules, the total capacity of which achieves 8 GB, 16 GB and 32 GB. All of them are equipped with original in design heatspreaders. They are also known to support Intel XMP overclocking profiles and to operate at 1.65 V power voltage.


Detailed Specifications


TridentX DDR3-3000 modules will be available in 4x8 GB kits (32 GB). Their effective frequency showings make up 3000 MHz with 12-14-14-35 latencies.


TridentX DDR3-2933 modules will be available in 2x4 …
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