Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …

TUL Takes Up Producing Brand PowerColor Graphics Adapter

TUL Corporation has announced the release of its brand high-performance graphics adapter, codenamed PowerColor Radeon HD 7950 Boost State Edition. The major peculiarity of the new product is the integration of GDDR5 memory type with 384 bit interface and support of multiple advanced technologies.



The model is based on black circuit board with the integrated Tahiti PRO chip, developed under 28 mm technological process. This chip accommodates 1792 current processors designed on Graphics Core Next architecture. This graphics adapter is compatible with PCI Express 3.0 x16 bus and DirectX 11.1 facility. The overall volume capacity of GDDR5 memory equals to 3072 MB. Heat management process is realized due to the two-slot cooling system of active type. The rear panel of the adapter is alloted for HDMI and DVI slots, as well as, for a couple of mini-DisplayPort ports.


The nominal frequency of graphics core equals to 850 MHz; nevertheless, the implementation of AMD PowerTune …

Thermaltake to Release a New Urban Chassis: Urban R31

Thermaltake Technology has just annunciated the release of yet another representative of Urban series: Urban R31. The chassis features mid-tower form-factor with 511x206x490 mm dimensions. It might boast a minimalist design concept with totally black coating, steel case, and aluminum frontal facet. The company offers the model in two framework variations: with an onboard side window and with a blind side facet. Unfortunately, there is no news so far concerning the pricing and an exact release date.



Thermaltake Urban R31 is ready to accommodate ATX or micro-ATX motherboards. Its internal layout comprises three 5.25-inch drive bays, six 3.5-inch drive bays, and one 2.5-inch drive bay. In addition, the chassis comes with a built-in dock-station on the top facet, ready to house one more 3.5/2.5-inch drive. Closer to the rear facet one can find seven PCI expansion slots.


To continue, spacing within the case allows for the integration of rather lengthy graphics cards (up to 410 …
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