Monitors with high resolution have deeply penetrated into our lives. Full HD resolution is considered to be a necessity for the up-to-date video standard, so manufacturers of not only PC monitors but also other devices, such as smart phones, mobile gadgets, etc., try to implement this standard into their products. Still, progress marvels us with a new development: more advanced WQHD resolution of 2560x1440 is gradually integrated into the monitors. Dell decided not to lag behind the pioneers in this sphere and designed a new model U2712HM.



Design and Ergonomics


Monitor Dell U2713HM is housed in a black or silver-black dull casing. The implementation of WLED lighting allowed the manufacturer to reduce the depth of the enclosure. It is fixed on a durable plastic stand connected to a black base with beveled angles and a central turntable. The base is made of solid metal; its rear board accommodates six rubber feet which are firmly pressed to the surface and save the monitor …

The company ASRock, as well as Gigabyte, appreciates the prospects of cutting-edge interface Thunderbolt, so much that it has supplied motherboard Z77 Extreme6/TB4 with four corresponding slots. The novelty is based on existing models with the prefix Extreme6, but its layout is slightly different from the original. In particular, the place of mini-PCIe slots and a pair of PCI slots are occupied with PCI-E x1, and PCI-E x4.



For those who don’t remember all specification, there is a reminder: ASRock Z77 Extreme6 uses a bunch of processor socket LGA1155 for two-and quad-core CPU Ivy Bridge (22 nm) and Sandy Bridge (32nm) chipset and overclocking Intel Z77 Express. The exact specifications of the new model are not listed. Its predecessor could work with three video adapters Radeon in 3-Way CrossFire (x8 + x4 + x4) or two GeForce in SLI (x8 + x8), DDR3 memory with a frequency of 2800 MHz and above, had a four-channel SATA 6 Gb / s and the same number of SATA 3 Gb / s and USB 3.0.
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Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …