Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Intel Core i7-4000 Release is Scheduled for Q3’13

Intel has just unveiled its current year release plans and made a specific focus on Intel Core i7-4000 processor series. According to Intel, the new line of products, known also as Intel Ivy Bridge-E, is going to hit the market in Q3’13. Their launch will replace the Sandy-Bridge-E series – Intel Core i7-3000. The new-comers will support Socket LGA2011 CPU sockets, as well as Intel X79 chipset. This is called to dramatically facilitate the updating process of the current systems.



The first three models to appear in the market will be Intel Core i7-4960X, Intel Core i7-4930K, and Intel Core i7-4820K. They will all be delivered with an unlocked multiplier. The first two models are known to have six physical and twelve virtual processor cores.


The nominal frequency of Intel Core i7-4960X equals to 3.6 GHz and the dynamic frequency might achieve 4.0 GHz index. This processor will be equipped with 15 MB of cache-memory. Its cost will fluctuate within the measures of $1000. …

SilverStone Heligon HE01 - a new super-cooler

The Taiwanese company introduced a bulky cooler SilverStone Heligon HE01, which is designed to cool down more or less all types of modern CPUs — from Intel LGA775 up to LGA2011 and from AMD AM2 to AMD AM3 + / FM2.



The construction does not weigh less than 1.1 kg, since in addition to two-part radiator (926 g) it is equipped with fan of 140x140x38 mm size. Linear dimensions of Heligon HE01 are 140 mm in width, 119 mm in length and 160 mm in height. Staples that hold the fan, take a few millimetres of space.


The thickness of a pair of «towers», joined by six nickel-plated copper heat pipes with a diameter of 6 mm, is uneven. The intense air flow passes successively through a thin array of aluminium fins, and then through the fan, afterwards through a larger section of the radiator. Copper base with nickel cover is protected with a film from scratches.


The manufacturer claims that Heligon HE01 will cope with the withdrawal of 300 watts of heating power.


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