SSD Silicon Power Velox V60 Review

SSDs got implanted into IT market long time ago but still manage to provide potential customers with innovative and efficient solutions. There is no wonder that SSD market is represented by a large number of products oriented as on enthusiasts so on average people with average needs. Silicon Power is among the companies that frequently gladdens its clients with ever newer models and advanced technologies. Its new Velox V60 series is ready to offer an unmatched performance and unprecedented durability, along with rather 'stinging' price. However, its specifications justify the high cost.



Delivery Kit


Silicon Power Velox V60 is delivered in a compact cardboard, the external cover of which is full of information about this model. The kit involves a set of necessary for usage components, such as accompanying documentation, user manual, 3.5-inch adapter, and a set of screws. The screws are a useful means for the installation of the SSD not only in a dedicated slot in laptop, …

Seven-Port USB 3.0 Hub H7988-U3 from Orico

Chinese company Orico has just voiced good news for all people craving for a comprehensive device which enables numerous USB 3.0 connections. Its new seven-port hub H7988-U3 is able to satisfy the needs of any customer who feels the need for several simultaneous USB 3.0 connections. This is not the first Orico's attempt to produce a really multi-functional device. The company has recently introduced PC expansion chip with PCI Express x1 interface which involved seven ports as well. Analogous functionality has been implemented in a new external hub H7988-U3.



Orico H7988-U3 goes in two color variants (black and white) and is based on VIA VL801 controller. The framework of the hub is rather suitable for the multi-connection operations. All available USB 3.0 ports are located on the side plates: three ports on the frontal plate, and two in each side plates. The rear plate accommodates the switch, USB 3.0 port to be connected with PC, and input to be connected with the power network …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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