Product line of NZXT, an American hardware developer and supplier, is basically targeted at gamers and enthusiasts. Its chassis and power supply units prove to demonstrate highly-efficient characteristics and, in some terms, outstanding performance. Still, the company expands its customer audience by developing products for middle-end and entry-level consumer groups. Its latest chassis model Tempest 210 belongs exactly to the budgetary sector due to the reasonable correlation: quality – price. Being an entry-level product, NZXT Tempest 210 is ready to offer quite satisfactory facilities and performance.



Design


Design of NZXT Tempest 210 chassis can be called classical. This is confirmed by all straight lines and standard framework. Grid-like frontal panel is the only distinguishing feature of the model. The rear panel is analogous to the majority of other classical enclosures. Tempest 210 is delivered only in black version to add universality to the model's utilization. …

Foxconn has officially announced the release of a new motherboard B75M developed in microATX form-factor. The new product will be distinguished by an attractive price and available up-to-date kit of interfaces useful for home-based and corporate PCs. B75M will be compatible with Intel Ivy Bridge processors of the third generation (Core i3, i5, and i7). This motherboard employs only high-end components which prevent the system from malfunctions or interruptions: the integration of Japanese solid-state capacitors with the minimal error-free running time which achieves sixty thousand hours. Such approach is more vital for the systems that get used to work in 24/7 mode.



The integrated PCI-E 3.0 bus allows the installation of the most updated graphics adapter. SATA III port empowers the usage of speedy SSDs and HDD potential, while three USB 3.0 ports are destined to ensure the linkage with the external devices at maximal speed index. Motherboard Foxconn B75M is also furnished with …

About a month ago Apacer Technology announced the release of new DDR3 memory modules to replenish Armor series. Codenamed Apacer Armor DDR3, these modules are chiefly targeting overclockers and inveterate gamers who long for the high-speed performance in various environments. Good news for all Apacer's customers is that the release of these outstanding products is scheduled for the mid January, 2013.



Modules Armor DDR3 consist of heatsinks which resemble 'armor', while the series itself is represented by the items of various colors, including red, yellow, blue, and black versions. This way the customer will be able to select the most suitable module to correspond to the overall chassis and motherboard color gamma. The heatsinks feature quite typical dimensions and this automatically eliminates all problems connected with the installation of voluminous CPU coolers.


The implemented printed circuit board is given black coverage in combination with eye-catching yellow, blue …