Biostar Launches High-Performance Motherboards TZ77B

Biostar has recently introduced its new series of motherboards, codenamed Biostar TZ77B, and is currently starting mass delivery of them to the market. TZ77B model is developed on Intel Z77 logics kit and goes in ATX form-factor. Manufacturers claim that the new series is able to ensure high performance and stability of operation at moderate price. These motherboards support all LGA1155 processors Intel Core (i3, i5 and i7) of the 2nd and 3rd generation.



Powerful graphics core DirectX 11, integrated into Intel Core processors (of the third generation), enables the compatibility with the majority of up-dated 3D games and HDMI 3D Visual technology. Video output is realized via digital HDMI, VGA (analogue), and DVI (with HDCP technology) interfaces. The availability of PCI-E 3.0 x16, PCI-E x16 2.0 (x4) and PCI-E x1 2.0 interfaces adds facilities for digital graphics.


Biostar TZ77B proves to demonstrate up to 95W TDP level, including unblocked CPU with K index. The motherboard …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …

Lian Li to Release Irregular PC-O5 & PC-O5S Cases

Lian Li Industrial Co. gets ready to start retail sales of two extraordinary PC cases: PC-O5 and PC-O5S. Designed in mini-ITX form-factor, both new-comers boast an open-air design concept where one of the side panels has a totally transparent facet from a hardened glass. The other distinctive feature is an irregular internal layout: the integrated graphics adapter is located in the bottom section and joined with the motherboard by a dedicated card; the PSU is located on a par with the adapter.



Lian Li PC-O5 features 384x390x133 mm dimensions and weighs 5.4 kg. It is able to accommodate one thin ODD, up to four 3.5-inch or five 2.5-inch drives as well as three PCI expansion cards. The maximal length of compatible graphics adapters makes up 190 mm, the ultimate height of compatible CPU coolers – 70 mm, whereas the maximal length of compatible PSUs – 140 mm. The model is delivered with a pre-installed 140 mm fan, a pair of USB 3.0 ports, and HD Audio connectors.


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