CES 2013 provided room for Intel to show all its might and recent achievements in PC hardware industry. Hence, the company unveiled a series of new motherboards intended at the overclocking of Intel Core i3, i5, and i7 CPUs of the second and third generation. Model, codenamed Intel DZ75ML-45K, is a bright representative of this series, being a large-scale entry-level solution. It is developed in micro-ATX form-factor and features 226x216 mm dimensions.



Motherboard Intel DZ75ML-45K is based on Intel Z75 chipset and employs Socket LGA1155 CPU slot. Power supply subsystem is designed according to 4+2 scheme, where 4 phases are responsible for CPU management. The board accommodates four DIMM slots for the integration of two-channel DDR3 RAM; its overall capacity might achieve 32GB. Besides, Intel has taken care about wide memory facilities that manifest themselves is various operational frequencies (from 1066 MHz to 2400 (OC) MHz).


All expansion facilities are provided by …

AMD has just released two new graphic processing units intended for solid server systems: AMD FirePro S7000 and S9000 models. According to the claimed specifications, both models are the most high-powered server GPUs currently available in the market. Their major destination is the application in different fields, including multimedia content editing and CAD. S7000 and S9000 can be used as graphics solutions in the complement of large data-centers and within the infrastructure of virtual desktops.



Both units are developed on an advanced Graphics Core Next architecture and support progressive brand technologies, like ZeroCore Power and PowerTune. Those technologies are called to reduce power consumption by almost 95% in idle mode. In addition, those GPUs support virtualization technologies designed by Microsoft, VMware, and some other developers. Both products are equipped with passive cooling system. High level of operating speed makes the models applicable in the most …

Thermaltake, a world-known producer of thermal solutions, chassis and PSU, has officially presented its new CPU cooler modification, codenamed BigTyp Revo. This model has already been introduced at Computex 2012 where it got a lot of encouraging reviews and good prospects for the sale campaign. BigTyp Revo is considered to be an efficient solution for the cooling down of the around-socket spacing due to the horizontal radiator localization. Thermaltake representatives underline that their new product is compatible with Intel (LGA775/1155/1156/1366/2011) and AMD (Socket AM2(+)/AM3(+)/FM1) platforms.



BigTyp Revo framework consists of a compact radiator, low-noise fan, five heat pipes and a set of aluminum plates. The new model has got an aluminum base and is furnished with five copper heat pipes (6 mm each). Each of the pipes directly 'gets in touch' with the CPU surface, providing an outstanding heat removal power. The top of the radiator accommodates 120 mm fan which can be …