New RAM Modules Ballistix Sport SODIMM from Lexar Media



Lexar Media, a well-known American designer of diverse digital media products, starts selling its new RAM series from Ballistix line. Entitled Sport SODIMM, the series is introduced by four SODIMM-DDR3 modules, intended for the incorporation into gaming laptops: BLS4G3N169ES4, BLS8G3N169ES4, BLS4G3N18AES4, and BLS8G3N18AES4. The quadruple is distinguished by an original design with the implementation of unique heatspreaders. All of them are optimized for Intel Core i5/i7 mobile processors of the fourth generation (Intel Haswell platform) and support all up-dated XMP profiles.


The most beneficial feature applied to Ballistix Sport SODIMM modules is their power-saving nature. They are able to operate at 10% lower power voltage than analogous products; hence, they reduce the laptop’s power consumption index and increase the time of its offline work.


To continue, the first two models, BLS4G3N169ES4 and BLS8G3N169ES4, come in 4 GB and 8 GB capacities correspondingly. They …

Wireless Router Asus RT-AC66U Review

Till recent past routers supporting 802.11n standards have been supposed as the most up-dated and powerful ones. However, nowadays this segment is outliving certain upgrade and a few manufacturers start integrating a new, more advanced standard – 802.11ac. One may wonder why developing one more standard if 802.11n is able to manage current video at high speeds. Still, the design of a more progressive item signifies more promising features. Asus RT-AC66U belongs to a new generation of routers exactly due to the support of 802.11ac.



Design


Asus RT-AC66U is housed in a black dull casing made of plastic. It is equipped with three external antennas which are intended to provide for a perfect sensitivity and high signal level. The manufacturer has taken care of router's comprehensive utilization, enabling both, vertical and horizontal, way of placement; there is also possibility to fix the item on the wall.


One of the characteristics pertained to this model is its …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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