Aresze Announces Chassis with Noiseless Cooling System

Enthusiasts and gamers might sigh with relief after their prolonged attempts to find the chassis for the creation of high-performance gaming systems. Aresze is going to release chassis, codenamed Seediq 8003, of new generation which is a perfect match for high-end gaming systems with unique cooling facilities. The chassis is developed in midi-tower form factor and features 520x215x508 mm dimensions. The casing is made of steel alloy, and is ready to accommodate motherboards of micro-ATX and ATX standards.

Despite the average dimensions, Aresze Seediq 8003 is compatible with CPU fans of 175 mm in height, large graphics adapters of up to 300 mm in length with HDD bays and up to 430 mm – without HDD bays, as well as, power supply units of ATX/EPS standard. This chassis has got quite efficient internal layout. Hence, it's equipped with ten sections for drives (four external 5.25 inch drives and six internal 2.5- 3.5 inch drives) and eight PCI slots for four graphics adapters.
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Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …

First SSDs from Asus to be Released Already in May

First seen at CES 2013 exhibition, Asus ROG RAIDR solid-state drives are on their final stage of development before an official release in May. Unlike the majority of contemporary SSD solutions in the market, the product from Asus features quite distinct form-factor, similar to expansion cards. The new drive is known to employ PCI Express 2.0 x2 interface with the support of x16/x8/x4 slots.

According to the preliminary data, ROG RAIDR solid-state drives will be available in two capacity variations – 120 GB and 240 GB. Both models will run under a couple of SandForce SF2281 controllers, comprised into RAID 0 array. MLC NAND flash-memory chips from Toshiba (designed under 19 nm technological process) will be the heart of revolutionary SSDs. Irrespective of the overall differentiation, ROG RAIDR will support a range of technologies traditional SSDs support, including S.M.A.R.T., TRIM and NCQ.

With the respect to the performance, both drives will be able to demonstrate …
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