The Debut of Cooler Master MasterLiquid Pro 140 and 280 CPU Liquid-Cooling Systems

This year the Cooler Master company has released a series of original MasterLiquid Pro liquid-cooling systems for Intel and AMD CPUs. The models with 120 mm and 240 mm heat sinks were the first to be released. Now it’s the turn of MasterLiquid Pro 140 and 280 devices, using the liquid-cooling systems heat sinks of the suitable size.



These novelties with a “one-piece” and “two-piece” heat sinks have much in common, though they differ in heat spreader dimensions (171 × 138 × 27 mm and 311 × 138 × 27 mm), as well as in the location of the 140 mm fans pair. MasterLiquid Pro 140 has them mounted on both sides of the heat dissipator and MasterLiquid Pro 280 — on the one side only.


Coolers consist of the big water unit with the inbuilt pump, pipes made out of fluorated ethylene-propylene copolymer in braided cable, the aluminum heat sink and fans with a high static pressure rate (up to 3.15 mm H2O).


The water unit base is manufactured out of copper. Inside of …

Scythe SCIOR-1000: a Comprehensive CPU Cooler with Top-Flow Design

Scythe is going to start the sales of its newest CPU cooler, entitled SCIOR-1000. It is honored for a comprehensive nature, since it might work with all contemporary CPUs, except for Intel Socket LGA2011 models. The other remarkable thing ascribed to the product is the employment of Top-Flow design.



Therein, the fan is localized over the heatsink, directing the airflow towards the whole framework, including the nickel-plated base. This way, it promotes for a better cooling effect.


Scythe SCIOR-1000 embraces also three 6 mm heat-pipes, along with a 100 mm fan. The latter supports PWM technology, so is able to reach the speed of 1800 RPM. The maximal noise level achieves 26.7 dB. Release date is scheduled for the final days of 2013. Some other specifications about the cooler are described below:

— framework dimensions: 136x117x107 mm, weight – 400 g.;

— supported platforms: Intel – LGA1366/115x/775 and AMD – FM1/FM2/AM2/AM2+/AM3/AM3+;

— heat-pipes: …

ARM Readies Cortex-A72 and Mali-T880 for Mobile Devices

ARM has just announced a series of solutions for the upcoming next-generation mobile SoC. The most notable developments are Cortex-A72 processor and Mali-T880 graphics. According to the manufacturer, both components will be interconnected within SoC by means of CoreLink – CCI-500. The launch of new items is scheduled for 2016. Rockchip, MediaTek and HiSilicon are among the companies to integrate both elaborations into their products.



It should be noted that Cortex- A72 is a successor of Cortex-A57, taking analogous 64-bit operations but demonstrating three times higher performance. The new-comer will be designed under 16 nm FinFET+ technological process. Its layout corresponds to big.LITTLE framework requirements; this promotes for its combination with other ARM cores.


As far as Mali-T880 GPU is concerned, it provides for 1.8 response time increase if compared with the Mali-T760 model. Herewith, its power consumption is reduced by 40%. Moreover, this GPU might support 4K …
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