Be Quiet! Unveils Dark Rock Pro 3 CPU Cooler

Be Quiet!, an outstanding designer of cooling solutions, is ready to release its newest CPU cooler – the Dark Rock Pro 3. The model is distinguished by an offbeat design, a voluminous heatsink section, and an invidious efficiency. Moreover, it is characterized by the support of practically all up-dated socket platforms, including AMD FM1, AM3, AM2, AM2+, 940, 939, 754, and Intel LGA 1150, 1155, 1156, 1366, 775, 2011. This wonderwork will soon be available for customers at the price tag of €79.90.



Be Quiet! Dark Rock Pro 3 features Tower design (122x132x163 mm dimensions) and consists of a copper base, a two-section aluminum heatsink with ninety plates, seven copper heatpipes, and a couple of fans. In order to enhance the cooler’s efficiency and eliminate corrosive effect, the manufacturer has implemented a nickel-plated coating for all framework elements.


The manufacturers decided to incorporate two different fans within the framework, though brand ones – …

Preliminary Acquaintance with VGA-Cooler MK-26 V2 from Prolimatech

Prolimatech Inc., an established manufacturer of high-end air-cooling systems, is about to release its new VGA-cooler, codenamed MK-26 V2. The upcoming product will be compatible with graphics cards from AMD manufacturer (up to Radeon HD 7000 Series) and Nvidia (up to GeForce GTX 600 Series). According to the preliminary data, the new cooler models will be capable to manage up to 320W of extra heat to provide for the most optimal GPU cooling down.



The major distinction of MK-26 V2 cooler is its impressive dimensions which equal to 230x146x47 mm. Thus, the cooler will take the spacing of five expansion slots, leaving no room for SLI/Crossfire. The cooler has got a copper base which accommodates six copper heatpipes, 6mm in gauge each pipe. Those pipes pierce two heterogeneous blocks consisting of thin aluminum fins which are designed in correspondence with Buckle Fin technology. The fins are distinguished by the unusual form that is called to promote for better heat removal …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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