Lifting the Veil from USB Type-C Bus

Since the launch in 1995, Universal Serial Bus (USB) has proved itself as the most successful ever computing interface. Nowadays tens of billions of electronic devices are connected together due to it. It goes without saying that this bus has outlived a few modifications, each distinguished by higher speed and reliability. Thus, today the community is able to revel in a completely new modification – USB Type-C – that forecasts a lot privileges of connectivity process. Let’s see what users will get with a new bus.



Layout and Connectivity


In physical terms, Type-C is a bit larger than USB 2.0 Micro-B but a bit tinier than binary USB 3.0 Micro-B, featuring 8.34x2.56 mm. Such dimensions enable its connection to the devices of any type, including the thinnest smartphones/tablets. The oval-shaped socket houses 24 contact outputs (to compare: USB 3.0 sockets feature only 9 outputs).


The most outstanding physical peculiarity of Type-C is a symmetric connector that …

Western Digital My Passport: two compact terabyte

Compact, not too heavy, with USB 3.0 interface and the volume of 2 terabytes – by these words the description of an external hard drive Western Digital My Passport can be finished. But there are more options to check: see how fast the new drive is, convenience of software and general impressions.



The line of portable hard drives from Western Digital is now consists of five main devices created to manage different tasks, but the model My Passport has a special place among them. The fact that the capacity of this drive can be up to 2 TB – and it makes possible not only to store in a portable digital stock a huge collection of videos, photos and any other materials, but also free to move it from home to work or to take with you on long journeys. Particular strain is not necessary, because the dimensions of the new item are only slightly greater than other models of Western Digital external hard drives.


The novelty comes in a small cardboard box with a blister. Inside, in …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
DevID agent v4.31
* The Utility requires installation. Upon installation and running DevID Agent will detect
which devices require drivers and which drivers require updates.
The Utility doesn't contain viruses or malicious code

Sony Corporation VGN-FE770G based on Sony Corporation VAIO

  • 1394
  • BATTERY
  • COMPUTER
  • DISPLAY
  • HDC
  • HIDCLASS
  • KEYBOARD
  • MEDIA
  • MODEM
  • MOUSE
  • MTD
  • NET
  • PCMCIA
  • SYSTEM
  • USB
  • VOLUME