Meet New High-Speed External Hard Drive Buffalo HD-GDU3

Buffalo Technology, a Japanese manufacturer of all innovatory storage devices and network solutions, showcases a new external hard drive, codenamed HD-GDU3, within the boundaries of DriveStation series. The new drive is housed in a black casing, featuring 45x126x202 mm dimensions. The model is known to have three capacity variations and, correspondingly, three different models: HD-GD1.0U3 (1TB), HD-GD2.0U3 (2TB) and HD-GD3.0U3 (3TB).



These external drives employ 3.5-inch hard drives as the basis and support an advanced high-speed USB 3.0 interface. Their layout involves 1GB of DRAM cache-memory which utilizes a dedicated caching software applet Turbo PC EX2, delivered along with the drives. This applet is called to immensely accelerate the data transfer process. The nominal delivery kit also includes a large software package with encoding and backup programs.


According to Buffalo developers, their HD-GDU3 is the fastest external hard drive ever seen. Thus, the maximal …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …

Antec Replenishes High Current Gamer M Series with Two New PSUs

Antec decided to expand its renowned High Current Gamer M series of power supply units with two new models. Codenamed HCG-750M and HCG-850M, the units are characterized by modular cable connectivity and rather high level of efficiency (up to 81% in 230V networks). Not for nothing this couple is honored by 80Plus Bronze certificate that vindicates their prime-quality. It must be noted that existent internal framework is totally the work of Seasonic, Antec’s contractor.



Both new-comers are equipped with four PCI Express Power (6+2)-pin cables and support 10/12/14/16-contact power sockets. The layout consists of two virtual +12V rails, Active PFC mechanism, and high-class Japanese capacitors. HCG-750M allows for the maximal loading on +12V rail of 62A at 744W, whereas HCG-850M allows a bit higher loading of 70A at 840W.


With the purpose to prolong the units’ lifetime, Antec furnished the models with all up-dated security functions, featuring: UVP (low voltage protection), …
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Acer, inc. Aspire 3680 based on Acer, Inc. Prespa1

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