Plextor Prepares the Release of M5P SSD

Plextor is currently preparing a new SSD series, codenamed M5P. According to the forecasts, this series will be differentiated by high-performance characteristics and Serial ATA 3.0 interface. M5P will be represented by three models of 128 GB, 256 GB and 512 GB volume capacities. All the model lines are developed with the utilization of 19 nm technological process. In addition, all SSDs will be equipped with NAND flash-memory (MLC Toshiba) and Marvell 88SS9187 controllers.

Three models differ from one another by the flash-memory volume. Thereby, 128 GB models accommodates 256 MB of DDR3 cache-memory, 256 GB model – 512 MB, and the last one, 512 GB model – 768 MB. Those SSDs support SATA 6 Gb/sec.

The manufacturer claim that the maximal consecutive reading and writing speeds will achieve 540 Mb/sec and 340 Mb/sec correspondingly (with 128 GB model); 256 GB and 512 GB models will achieve 540 Mb/sec in reading and 450 Mb/sec in writing mode. At the same time, M5P series …

Motherboard ASRock Z77 Extreme9 Review

Motherboards intended for gaming systems are developed and supplied by several reputable companies. ASRock belongs to their army and frequently releases motherboards with outstanding parameters. Its latest creation ASRock Z77 Extreme9 model is designed specifically for LGA 1155 socket and Intel Z77 processor. It is able to provide the users with appropriate efficiency and multiple opportunities to create a really high-performance gaming system.


Design of motherboard ASRock Z77 Extreme9 is not peculiar for the implementation of bright colors or excessive ornamental elements. Only gold yellow capacitors and decorative stripes on radiators add some glamor to the board. One of the stripes is lighted up by white LED; this option is provided by LED Heatsink Design facility. The motherboard is developed in ATX form-factor. Power supply is realized by means of Digi Power digital system that works by 8+4 scheme. All hot converter components are covered by a solid …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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