Corsair Introduces HXi 80Plus Platinum Power Supply Units

Corsair, a multi-profile American company, starts shipping new high-end PSUs of HXi series. The series currently combines three models with a totally modular design and the employment of Japanese electrolytic capacitors. Corsair HXi 750 W, Corsair HXi 850 W and Corsair HXi 1000 W models are distinguished by the highest efficiency of 91% that results in the conferment of 80Plus Platinum certificate.



Corsair HXi power supply units demonstrate compatibility with Intel Core CPUs (4th generation) and AMD’s latest APUs. The triple totally corresponds to ATX standard of the latest version. Cooling of all internal components is realized due to a low-noise 140 mm fan, based on a fluid-film bearing. Moreover, the implementation of Zero-RPM Fan Mode enables the blades to rotate only on the load pickup.


The units are furnished with a large set of protection tools, saving the layout from off-nominal conditions: voltage overloading, power overloading, input voltage overloading, …

Arctic Cooling Intros Two Modifications of Freezer CPU Cooler

Arctic Cooling AG, a well-known Swiss developer of cooling solutions, has recently introduced its newest CPU cooler, Freezer, in two modifications: i11 and A11. Both versions have got tower-like framework, featuring 108x90x130 mm dimensions. The Freezer i11 is compatible with Intel LGA 2011/1156/1155/1150 socket platforms, whereas its companion is intended for AMD Socket FM1, FM2, AM3, AM3+, AM2, and AM2+. To say more, this pair is able to cool down the ‘blaze’ of CPUs with 150 W TDP.



Arctic Freezer i11/A11 consists of an aluminum heatspreader with forty-five plates, three U-shape copper heatpipes, and one 92 mm fan. The heatpipes are thought to support direct contact technology that dramatically improves heat transfer process.


The implemented fan is developed on a fluid dynamic bearing and is equipped with a PWM controller. The latter assures that the blades could change their rotational speed within the ranges from 500 RPM to 2000 RPM. Herein, the maximal airflow …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Intel Corporation D945GCZ

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