The most functionally full models of the ASUS ROG STRIX RX 480 series have become the first exponents of the ASUS Radeon RX 480 video cards line. Recently they have been joined by the pair of ASUS Dual Radeon RX 480 series versions at a more affordable price. The simplified cooling system and lower number of features justify the lower price.
ASUS DUAL-RX480-8G and ASUS DUAL-RX480-O8G models are equipped with 8 GB of GDDR5 video RAM with the effective frequency of 8000 MHz, the Super Alloy Power II element base and the 2-fan cooler featuring the Wing-Blade design. These samples have been manufactured on the automatic ASUS AUTO-Extreme Technology line, and the power subsystem uses the 8-pin connector to guarantee the stable work even under the conditions of manual overclocking. In case you decide to connect the VR-headset, the pair of HDMI-ports on the interface panel will come in handy.
The only difference between ASUS DUAL-RX480-8G and ASUS DUAL-RX480-O8G is in their clock …
Gigabyte has gladdened all enthusiasts with the launch of a high-performance video card, entitled GeForce GTX D5X 8G. The new-comer boasts mill overclocking, a modified design & the implementation of a 3-fan cooler. The model comes equipped with Nvidia GP104-400 GPU that offers two operational modes: Gaming & OC. In Gaming mode the core runs at 1607/1733 MHz frequency, while in OC mode it rises up to 1632/1771 MHz frequency.
The GPU is accompanied by 8 GB of GDDR5X memory that operates at an effective index of 10010 MHz. The PCB is perfected by Ultra Durable VGA hardware base with the employment of copper in some layers as well as an enforced power supply subsystem (8+2-phase).
Gigabyte GeForce GTX 1080 D5X 8G accommodates WindForce 3X cooler. It consists of three composite copper heatpipes, a dual-section aluminum heatsink, a backplate, and three fans. It should be noted that when the system loading is insufficient, the cooler goes to the passive mode.
The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.
With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.
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