SilverStone Heligon HE01 - a new super-cooler

The Taiwanese company introduced a bulky cooler SilverStone Heligon HE01, which is designed to cool down more or less all types of modern CPUs — from Intel LGA775 up to LGA2011 and from AMD AM2 to AMD AM3 + / FM2.

The construction does not weigh less than 1.1 kg, since in addition to two-part radiator (926 g) it is equipped with fan of 140x140x38 mm size. Linear dimensions of Heligon HE01 are 140 mm in width, 119 mm in length and 160 mm in height. Staples that hold the fan, take a few millimetres of space.

The thickness of a pair of «towers», joined by six nickel-plated copper heat pipes with a diameter of 6 mm, is uneven. The intense air flow passes successively through a thin array of aluminium fins, and then through the fan, afterwards through a larger section of the radiator. Copper base with nickel cover is protected with a film from scratches.

The manufacturer claims that Heligon HE01 will cope with the withdrawal of 300 watts of heating power.

Regular …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.

New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.

Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …

Evga Launches One More Overclocked Graphics Card

Evga, a leading American supplier of 3D cards, is going to launch one more graphics card with factory overclocked speeds. A new model is based on Nvidia FeForce GTX 670 adapter and codenamed as Evga GeForce GTX 670 FTW LE. Its design resembles the one implemented in GeForce GTX 670 FTW card, but the main distinction between them is seen in frequency showings. The newbie demonstrates a bit lower frequency index than its predecessor.

Evga GeForce GTX 670 FTW LE is housed on a PCB designed for PCI-e 3.0 x16 bus. This card takes GK104 graphics core with 1344 CUDA cores as the basis; it is developed on Kepler architecture under 28 nm standards. Its inventory also embraces 2GB of GDDR5 memory (256-bit interface). Cooling system is introduced by a 2-slot cooler of active type with a single turbine-like fan. Power subsystem consists of two connection 6-pin sockets and requires a quite efficient PSU (not less than 500W power).

Frequency template looks the following way: GPU runs at …
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