Enermax to Announce a New Mid-Tower Case Fulmo ST

Enermax Technology, an established Taiwanese developer of various PC hardware components, is about to announce its new roomy PC case within the boundaries of Fulmo series. Codenamed Fulmo ST, the case is designed in mid-tower form-factor and is distinguished by massy dimensions. Featuring 485x244x513 mm, the product’s weight approximates 8.2 kg. The novice will be available in two color variations: gray (ECA3270A-G-BL) and black (ECA3270A-B-BL).



Fulmo ST is ready to accommodate up to eight PCI expansion cards, three 5.25-inch drives and eight drives either of 3.5- or 2.5-inch standard. The case is compatible with ATX and micro-ATX motherboards, quite lengthy graphics cards (up to 412 mm if demounting the top HDD/SSD bay), as well as rather lengthy dual-heatsink for the water-cooling system (up to 280 mm). The latter might be replenished by ten fans of either 120 mm or 140 mm dimensional type.


Upon the whole, Enermax will deliver its Fulmo ST case with three …

Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.



The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …

Intel to Take Care about Power-Efficiency of Ivy Bridge Processors

The rising competition between the two giants in the manufacture of processing units, Intel and AMD, makes each of the two invent ever newer technologies and implement them in their products. The attempts to dominate in the market and win as many consumers usually develop into brand new approaches and brand new advanced facilities.



In this light, Intel is going to upgrade its Ivy Bridge processors to make them more power-efficient. But power-efficiency does not imply that processing units will show less performance; quite the contrary, the manufacturer is willing to combine an utmost performance with the maximal power efficiency level.


Currently, the most power-saving processors of Ivy Bridge generation can be found in mobile devices on Windows platform and in Apple MacBook Air devices. Their TDP level is recorded at 17W. As appears from the above mentioned, the TDP level in upgraded Ivy Bridge processors will be lower than 17W, though the developers do not voice the margin …
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