Thermaltake Showcases an Original Bigwater 760 Pro Cooling System

Thermaltake Technology, a renowned Taiwanese designer of varied PC hardware pieces, is going to release its new original water-cooling system, codenamed Bigwater 760 Pro. This cooler is targeting powerful processors that require no less powerful cooling. The product demonstrates a wide compatibility with all novel processors that support Socket LGA775, LGA1366, LGA115x, LGA2011, FM1, FM2, AM2(+), and AM3(+).



Bigwater 760 Pro consists of three major parts: waterblock, head block and a couple of hoses. The implemented waterblock features nickeled-copper base of 45x35 mm dimensions. The head block features 252.8x145.8x84 mm dimensions and takes two 5.25-inch bays within the chassis. Its framework involves a pump, a heatsink and a tank for coolant.


The pump is based on a ceramic bearing and produces not more than 16 dB noise. Its performance level achieves 500 liters/hour, while Mean Time Between Failures index is estimated at eighty thousand hours. The integrated heatsink is …

Thermaltake Enters the Market with NiC L31 and L32 CPU Coolers

Thermaltake Technology has just started shipping a pair of budgetary CPU coolers from NiC series. Entitled NiC L31 and NiC L32, these two models are compatible with all updated Intel and AMD platform motherboards. In keeping with the manufacturer, the new-comers will not obstruct the mounting of memory modules, due to their well-considered framework. Hence, they consist of small-sized heatsinks, three U-shape heatpipes (8 mm), and a base that is in direct contact with the CPU.



The first model, NiC L31 (codename: CL-P001-AL12RE-A), features 140x128x40 mm dimensions and weighs 530 g. The integrated 120 mm fan might operate in various speed modes – from 500 RPM to 1800 RPM – thanks to the support for PWM technology. It produces up to 70.99 CFM and dissipates up to 160 W power.


At the same time, at the minimal speed mode it generates only 18 dB noise, however at the ultimate rotations this index rises to 34.8 dB. According to the results of multiple tests, this fan is …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Acer, inc. Aspire 5050 based on Acer, Inc. Prespa M

  • BATTERY
  • COMPUTER
  • DISPLAY
  • HDC
  • KEYBOARD
  • MEDIA
  • MODEM
  • MOUSE
  • NET
  • PCMCIA
  • PROCESSOR
  • SCSIADAPTER
  • SDHOST
  • SYSTEM
  • USB
  • VOLUME