Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …

Haswell processors for laptops will consume up to 57 W, desktop - up to 100

Intel provides with three graphics levels: GT1, GT2 and GT3. Desktop processors won’t receive graphics performance higher than GT2, but mobile processors will be able to boast of with GT3 class. Support of PCI Express 3.0 for Haswell processors will be quite usual characteristics, but at the memory controller little progress is seen — yet provides dual-channel DDR3-1600.



By energy consumption Haswell desktop versions will be divided into models with values of 35, 45, 65 and 95 watts of TDP level. For mobile processors the values are ​​37, 47 and 57 W. Finally, ultra book processors with built-in system logic will be filled by TDP level not more than 15 watts. It is assumed that this will enable them, among other things, be in standby mode up to 10 days without charge.


The desire of Intel to compete with AMD in terms of performance integrated in graphics processor, will add some work to companies producing cooling systems for laptops. The developers report about …

Motherboard Gigabyte Z77MX-D3H TH Review

Each new year brings new ideas for the developers of PC hardware. Since motherboards are indisputably the main component in the PC integration, their design and facilities are given the most attention. Hence, each manufacturer tries to implement some unprecedented technologies to attract potential audience by an improved performance and possibilities. Intel Thunderbolt technology is a hit of 2012; that is why, motherboard designers turned their looks into this direction. Gigabyte was among the first companies to integrate Thunderbolt interface into its products: model Z77MX-D3H TH is a bright evidence of it.



Integration


Motherboard Gigabyte Z77MX-D3H TH resembles the modification of its predecessor Z77MX-D3H, except for the availability of Thunderbolt interface and design of PCB. The renunciation of the third PCIe x16 slot allowed the manufacturer to free four lines of PCIe bus and employ Thunderbolt technology for their activation. As a result, a new product has got a …
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Dell Inc. Latitude D620 based on Dell Inc. 0KX350

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