SilentiumPC enters the market with a new mid-tower case, entitled Pax M70 Pure Black. The model features 467x230x483 mm dimensions and weighs 8.55 kg. As seen from the title, the case boasts purely black paintwork that adds elegance to the styling. The chassis is made of SECC steel; side panels as well as decorative lid are coated in soundproof dual-layer materials. Pricing is set at $80.
Xigmatek, a renowned Taiwanese designer of prime-class PC hardware, has launched a follower of the well-known Midgard case series – the Midgard III. It features 409(d)x515(h)x260(w) mm dimensions, always ready to accommodate mini-ITX, micro-ATX, and standard ATX motherboards. The case has got a sleek stern design, though is peculiar by the availability of a unique wireless charger station (Qi standard), leaving all competitors way behind (in terms of connectivity).
LG smartphones developed on Windows Phone platform didn’t live up to the corporate management and developers’ expectations. The sales volume of such devices leaves much to be desired. In contrast to such statistics, LG smartphones developed on Android platform enjoyed wide popularity among huge customer audience.
HSP56 WDM DEVICE ((NVidia)
PCI\VEN_1039&DEV_7013
HSP56 WDM DEVICE (ALI)
PCI\VEN_10B9&DEV_5450
HSP56 WDM DEVICE (ALI+)
PCI\VEN_10B9&DEV_5457
HSP56 WDM DEVICE (Intel)
PCI\VEN_10DE&DEV_0069
HSP56 WDM DEVICE (Realtek)
PCI\VEN_10DE&DEV_00D9
HSP56 WDM DEVICE (SIS)
PCI\VEN_10DE&DEV_01C1
HSP56 WDM DEVICE (VIA)
PCI\VEN_10EC&DEV_8197
PCI\VEN_1039&DEV_7013
HSP56 WDM DEVICE (ALI)
PCI\VEN_10B9&DEV_5450
HSP56 WDM DEVICE (ALI+)
PCI\VEN_10B9&DEV_5457
HSP56 WDM DEVICE (Intel)
PCI\VEN_10DE&DEV_0069
HSP56 WDM DEVICE (Realtek)
PCI\VEN_10DE&DEV_00D9
HSP56 WDM DEVICE (SIS)
PCI\VEN_10DE&DEV_01C1
HSP56 WDM DEVICE (VIA)
PCI\VEN_10EC&DEV_8197