Zalman Introduces Highly Efficient FX70 Passive Cooler

Zalman, a renowned South Korean designer of various hardware solutions, has recently introduced its latest CPU passive cooler, entitled FX70. The new-entry features 110x140x158 mm dimensions and comes without any fans. However, if there is a need to cool down CPUs with the TDP level higher than 80 W, the customer is free to enhance the facilities by adding two 120 mm fans. The latter are fixed to the heatsink by means of four brackets.



Zalman FX70 is an optimal choice for the following platforms: Intel LGA 2011/1366/115x/775 and AMD FM2/FM1/AM2/AM2+/AM3/AM3+. This cooler fits in any mid-tower ATX and larger PC chassis. The cooler’s framework consists of a copper base, pierced by six nickel-plated heatpipes, and of fifteen heatsink plates with an offbeat design, codenamed Twist; they are called to dramatically improve the process of heat management.


Fanless framework is regarded to be an advantage due to three reasons. First of all, pure heatsink provides absolutely no …

Deepcool is preparing a new cooler with heat pipes

Deepcool production company of inexpensive and quite efficient cooling systems has provided a sample of CPU cooler — Big Frost (tentative codename), which is an extension of current Frostwin model. Previous model has 4 sintered powder heatpipes, which conduct heat from the processor to protect it from overheating. Also, like a new model, it has 120mm fans.



New model has a simple design, but strict, almost «standard», forms will not prevent it from showing a decent performance. It works with less noise and performs an effective cooling. Big Frost consists of a nickel-plated copper base with a miniature auxiliary radiator, six U-shaped copper heatpipes, each of 6 mm in diameter, and two sections of aluminium plates of similar thickness. Pre-installed fans are running at different speeds. One turns with intensity of 1300 r / min (22.6 dB noise), the other — in the range from 900 to 1500 rev / min (21,4-32,1 dB).


Dimensions of construction form 126x136x159 mm, weight — …

Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.



The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …
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