Zalman Debuts with Reserator 3 Max Dual Liquid Cooler

Zalman has officially launched a new liquid cooling system, Reserator 3 Max Dual, firstly introduced at CES 2014. It is peculiar by the support of all up-to-date CPU sockets for AMD and Intel platforms, as well as by outstanding performance. With the aim to enhance heat dissipation effect, the company supplements the model with a proprietary Zalman ZM-STG2M thermal grease.



Zalman Reserator 3 Max Dual consists of a waterblock with a copper base, two connecting hoses, two heatsinks, and a pair of 120 mm fans. The base of the waterblock boasts an improved framework; it has got a flanged coating that promotes for the acceleration of heat dissipation. Both heatsink sections are nickel-plated. The heatpipes implemented within their framework resemble a maze; this allows liquid to employ the maximal dispersion area.


The incorporated 120 mm fans are equipped with a long life bearing and a bright blue LED. Their operation is adjusted by means of PWM technology, so the rotational …

Thermalright Unveils a Colossal HR-22 CPU Heatsinks

Thermalright, a top-ranked Taiwanese developer of cooling solutions, has recently unveiled its newest CPU heatsink, entitled HR-22. The new-comer features 120x150x159 mm dimensions and is peculiar by nearly ‘colossal’ cooling effect. The HR-22 is targeting all up-dated platforms with Intel LGA2011/LGA1366/LGA115x and AMD FM1/FM2/AM3/AM3+ sockets. The company promises to start the sales in the nearest future, though pricing is still unknown.



Thermalright HR-22 boasts a tower-like framework, consisting of a copper base, thirty-five aluminum plates, and eight nickel-plated heatpipes (6 mm each). The only hexagonal notch in the center is thought to simplify the heatsink installation.


All the plates contain rectangular holes that facilitate the airflow when used in passive mode. Such peculiarity is called Direct Passive Airflow System (DPAS). It not only provides for an efficient cooling and unimpeded airflow, it saves the users’ ears from noise: a powerful heatsink is …

Lian Li to Combine Performance with Compact Size

Chassis of Full-Tower form-factor usually have solid framework due to the layout scheme and the necessity to enclose a lot of components. Developers from Lian Li company have totally demolished the current tendencies and announced the release of their PC-V750 Full-Tower model with the front-end PSU localization. This allowed the designers to dramatically decrement the size of the chassis without sacrificing its capacity and general specifications. The compact size of the chassis is considered to be a kind of ‘revolution’ in the market, since it is compatible not only with ATX and microATX motherboards, but also with Extended-ATX boards.



Lian Li PC-V750 casing is made of aluminum and approximates 7.35 kg in weight. Its dimensions provide for the installation of massive CPU-coolers (up to 170 mm in height), up to ten expansion cards, including 380 mm 3D cards. The chassis is equipped with five fans of 120 mm each: the two fans are located on the front plate, the other two – …
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