Scythe SCIOR-1000: a Comprehensive CPU Cooler with Top-Flow Design

Scythe is going to start the sales of its newest CPU cooler, entitled SCIOR-1000. It is honored for a comprehensive nature, since it might work with all contemporary CPUs, except for Intel Socket LGA2011 models. The other remarkable thing ascribed to the product is the employment of Top-Flow design.



Therein, the fan is localized over the heatsink, directing the airflow towards the whole framework, including the nickel-plated base. This way, it promotes for a better cooling effect.


Scythe SCIOR-1000 embraces also three 6 mm heat-pipes, along with a 100 mm fan. The latter supports PWM technology, so is able to reach the speed of 1800 RPM. The maximal noise level achieves 26.7 dB. Release date is scheduled for the final days of 2013. Some other specifications about the cooler are described below:

— framework dimensions: 136x117x107 mm, weight – 400 g.;

— supported platforms: Intel – LGA1366/115x/775 and AMD – FM1/FM2/AM2/AM2+/AM3/AM3+;

— heat-pipes: …

Deepcool Comes Out with White SW Chassis

Deepcool Industries has added a new White SW model to its mid-tower PC chassis series. The new-comer features 472x210x454 mm dimensions and fits office environment the best. Its framework is made of galvanized steel plates (SECC), painted white, with black-and-white frontal edging, perforated notches, and a large side acrylic window. The model might be already procured at the retail price of $35.



Deepcool White SW is compatible with mini-ITX, micro-ATX and ATX motherboard types. It provides space for four external 5.25-inch drives, four internal 3.5-inch drives, and three internal 2.5-inch drives. Expansion of facilities becomes possible due to seven expansion slots. It should be mentioned that all the bays are equipped with special slides which facilitate mounting without screws.


In order to ensure an optimal airflow, the case accommodates an efficient cable management system and dust filters. The top-front I/O panel boasts USB 3.0, USB 2.0 ports as well as 3.5 mm slots …

Intel to Take Care about Power-Efficiency of Ivy Bridge Processors

The rising competition between the two giants in the manufacture of processing units, Intel and AMD, makes each of the two invent ever newer technologies and implement them in their products. The attempts to dominate in the market and win as many consumers usually develop into brand new approaches and brand new advanced facilities.



In this light, Intel is going to upgrade its Ivy Bridge processors to make them more power-efficient. But power-efficiency does not imply that processing units will show less performance; quite the contrary, the manufacturer is willing to combine an utmost performance with the maximal power efficiency level.


Currently, the most power-saving processors of Ivy Bridge generation can be found in mobile devices on Windows platform and in Apple MacBook Air devices. Their TDP level is recorded at 17W. As appears from the above mentioned, the TDP level in upgraded Ivy Bridge processors will be lower than 17W, though the developers do not voice the margin …
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Hewlett-Packard HP 2133 (FV337PA#UUF) based on Hewlett-Packard 3030

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