The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …

The sphere of cloud computing is gradually gaining in pace. In this light, this industry feels the need for the qualitative and advanced performance, as well as, enlarged capacities. Apacer is the one to understand the current tendencies by announcing the future release of SSD series specifically for cloud computing purposes. Its new SAFD 25A are promised to demonstrate both, high-end performance and capacity. The product's primary destination can be identified as an efficient tool to be employed in servers and cloud-based computing.



SAFD 25A is characterized by high performance IOPs (up to 50000 IOPs) and enlarged storage volume capacity up to 512 GB. Such specifications witness of the undeniable benefits given to customers in terms of data storage, editing and sharing. SAFD 25A can boast such outstanding features as anti-vibration and anti-shock which promote for the SSD durability. In addition, this series will be distinguished by low power consumption index that can't but …

In May this year, Lenovo, HP, along with being the largest manufacturer of branded PCs, has announced plans to release 14-inch ultrabook premium-level ThinkPad X1 Carbon. In order to attract affluent buyers who are in search of a fashion mini-PC, the frame and lid are made of CFRP (carbon fiber) — lightweight and durable material that is used, including in the aerospace industry, and expensive cars. Due to this, the thickness of the laptop is reduced to 17.7 mm, and weights — up to 1.36 kg.



Screen of Lenovo ThinkPad X1 Carbon has a resolution of 1600x900 pixels, a maximum brightness of 300 and wide viewing angles. Graphic system is presented by built Adapter Intel HD 4000 into the processor Ivy Bridge. RAM is 4 GB and can be expanded up to 8 GB. Keyboard ThinkPad Precision doesn’t have numeric keypad, but it has an LED backlight.


In addition, the novelty has a webcam 720p, battery with a resource of battery life of up to 6 h 20 min., fingerprint scanner, connectors …