Enermax to Announce a New Mid-Tower Case Fulmo ST

Enermax Technology, an established Taiwanese developer of various PC hardware components, is about to announce its new roomy PC case within the boundaries of Fulmo series. Codenamed Fulmo ST, the case is designed in mid-tower form-factor and is distinguished by massy dimensions. Featuring 485x244x513 mm, the product’s weight approximates 8.2 kg. The novice will be available in two color variations: gray (ECA3270A-G-BL) and black (ECA3270A-B-BL).



Fulmo ST is ready to accommodate up to eight PCI expansion cards, three 5.25-inch drives and eight drives either of 3.5- or 2.5-inch standard. The case is compatible with ATX and micro-ATX motherboards, quite lengthy graphics cards (up to 412 mm if demounting the top HDD/SSD bay), as well as rather lengthy dual-heatsink for the water-cooling system (up to 280 mm). The latter might be replenished by ten fans of either 120 mm or 140 mm dimensional type.


Upon the whole, Enermax will deliver its Fulmo ST case with three …

Xigmatek to Release Dark Knight II CPU Cooler

Xigmatek, a multi-profile Taiwanese company, is about to launch its second version of Dark Knight CPU cooler – the SD1483. Featuring 120x50x159 mm dimensions, this tower-like device comes in two color variations: black and white (Frostbourne). The model supports processors with the utmost TDP level of 160 W, designated for AMD AM2/AM3/K8 & Intel LGA 775/1155/1156/2011 platforms.



Xigmatek Dark Knight II SD1483 consists of a small-sized heatsink with fifty-five aluminum thin fins; the latter boasts ceramic coating that is called to enhance heat dissipation area. The heatsink is pierced by three 8 mm heatpipes which support direct contact technology.


The framework also accommodates a single 140 mm fan, based on slide bearing. It is estimated for 150.000 hours of foolproof operation. The integration of PWM technology enables the variation of rotational speed from 800 RPM to 1200 RPM. The blades produce up to 90.3 CFM airflow at the maximum 18 dB noise level. According to the …

Intel to Take Care about Power-Efficiency of Ivy Bridge Processors

The rising competition between the two giants in the manufacture of processing units, Intel and AMD, makes each of the two invent ever newer technologies and implement them in their products. The attempts to dominate in the market and win as many consumers usually develop into brand new approaches and brand new advanced facilities.



In this light, Intel is going to upgrade its Ivy Bridge processors to make them more power-efficient. But power-efficiency does not imply that processing units will show less performance; quite the contrary, the manufacturer is willing to combine an utmost performance with the maximal power efficiency level.


Currently, the most power-saving processors of Ivy Bridge generation can be found in mobile devices on Windows platform and in Apple MacBook Air devices. Their TDP level is recorded at 17W. As appears from the above mentioned, the TDP level in upgraded Ivy Bridge processors will be lower than 17W, though the developers do not voice the margin …
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TOSHIBA Satellite C665 based on TOSHIBA Portable PC (PSC57K-00D003)

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