Zalman Debuts with Reserator 3 Max Dual Liquid Cooler

Zalman has officially launched a new liquid cooling system, Reserator 3 Max Dual, firstly introduced at CES 2014. It is peculiar by the support of all up-to-date CPU sockets for AMD and Intel platforms, as well as by outstanding performance. With the aim to enhance heat dissipation effect, the company supplements the model with a proprietary Zalman ZM-STG2M thermal grease.



Zalman Reserator 3 Max Dual consists of a waterblock with a copper base, two connecting hoses, two heatsinks, and a pair of 120 mm fans. The base of the waterblock boasts an improved framework; it has got a flanged coating that promotes for the acceleration of heat dissipation. Both heatsink sections are nickel-plated. The heatpipes implemented within their framework resemble a maze; this allows liquid to employ the maximal dispersion area.


The incorporated 120 mm fans are equipped with a long life bearing and a bright blue LED. Their operation is adjusted by means of PWM technology, so the rotational …

ECS Develops Haswell-Compatible Motherboard Z87H3-A2X Extreme

At the cusp of an official release of Intel’s fourth generation processors each hardware designer tries to elaborate new Haswell-compatible components. Motherboard manufacturers are probably the ones to introduce the lion’s share of such products. ECS is not an exception. According to the data provided by a reputable source, ECS is soon going to release its newest prime-class board codenamed Z87H3-A2X Extreme. The first meeting with the new-comer is planned within the boundaries of Computex 2013 exhibition taking place in June.



As seen from the codename, ECS Z87H3-A2X Extreme is based on Intel Z87 Express chipset covered by a black-and-red heatsink. The model employs full-sized printed circuit board, Socket LGA1150, and 12-phase VRM for CPU power supply with gold-plate solid-state capacitors. Power subsystem elements are cooled down by a voluminous CoolTech V heatsink. This heatsink is connected with a chipset one by means of a nickel-plated copper heat pipe.


To …

The First Glimpse on Motherboard Foxconn B75M

Foxconn has officially announced the release of a new motherboard B75M developed in microATX form-factor. The new product will be distinguished by an attractive price and available up-to-date kit of interfaces useful for home-based and corporate PCs. B75M will be compatible with Intel Ivy Bridge processors of the third generation (Core i3, i5, and i7). This motherboard employs only high-end components which prevent the system from malfunctions or interruptions: the integration of Japanese solid-state capacitors with the minimal error-free running time which achieves sixty thousand hours. Such approach is more vital for the systems that get used to work in 24/7 mode.



The integrated PCI-E 3.0 bus allows the installation of the most updated graphics adapter. SATA III port empowers the usage of speedy SSDs and HDD potential, while three USB 3.0 ports are destined to ensure the linkage with the external devices at maximal speed index. Motherboard Foxconn B75M is also furnished with …
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Dell Computer Corporation OptiPlex GX270 based on Dell Computer Corp. 0U1325

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