Asus Replenishes X99 Motherboard Lineup with 4 New Items

Asus adds to its renowned lineup of X99 motherboards a set of new solutions. All the greenhorns are based on Intel X99 chipset targeting socket LGA2011-v3 platforms. Thus, they support the installation of Haswell-E & Broadwell-E CPUs (Intel Core i7). The boards brag about the incorporation of multiple innovations and technologies. The latter include:

— OC Socket ensures more efficient CPU & memory overclocking;

— Asus Aura offers RGB backlight and allows for the connection of additional LED stripes;

— 5-way Optimization helps in fine tuning of system components;

— Asus SafeSlot provides for an enforced framework of PCIe slots.



Motherboard Asus X99-Deluxe II features the following specifications:

— memory subsystem: 8 DIMM slots for DDR4 memory with 3333 MHz frequency, up to 128 GB;

— storage subsystem: 2 M.2 slots, 2 U.2 slots, 1 SATA Express, 8 SATA 6 Gb/sec;

— audio subsystem: Crystal Sound 3;

— network: LAN – Intel I218-V, Intel …

Bezel-less Monitor Asus MX239H Review

Bezel-less displays continue their incursion into the contemporary monitor segment by offering truly unique, truly high-end viewing experience. Asus always marches in step with all market trends, so the launch of MX239H model was not a surprise. This product differentiates itself by a really high cost that significantly surpasses the price of rival bezel-less displays. However, its design, ergonomics and imaging justify its high price. Let’s see what else MX239H can offer to customers.



General Specifications


Asus MX239H features the following specifications:

— panel type: AH-IPS;

— backlight: W-LED;

— display: 23 inch, aspect ratio – 16:9, resolution – 1920x1080 pixels, response time – 5 ms;

— displayed colors: 16.7 m;

— brightness: 250 cd/m2;

— contrast: stat – 1000:1, dynamic – 80.000.000:1;

— viewing angles: 178/178 degrees;

— acoustic system: ICEPower, two speakers (3W each), two audio I/O slots;

— video …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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