Promise Increases Volume Capacity of External Drive Pegasus R6

Promise Technology, a global provider of storage solutions, has renewed its Pegasus R6 external drive with Thunderbolt interface adding more volume. The changes were made in the capacity of the drive which was augmented to 18 TB, following the previous models with 12TB. Such augmentation became possible due to the support of 3TB drives. According to the Promise, the renewed device will be of benefit to those consumers who work with video editing and huge files.



Pegasus R6 is characterized by high performance that will be sufficient for the management of several streams of uncompressed video. Thus, this external drive is able to develop the speed of data transfer up to 900 Mb/sec. Such showings prove that Thunderbolt interface surpasses all other up-dated interfaces (USB 3.0, FireWire, etc.) in speed terms.


To continue, the launch of a model with 18 TB volume capacity resulted in the price cuts for the models with 12 TB capacities. Under the latest data voiced by the …

ASRock Showcases H61M-VG4 Motherboard for Ivy Bridge Processors

In spite of the commotion incited by the upcoming release of Intel Haswell processors and the growth of products compatible with their technical requirements, Intel Ivy Bridge CPUs will continue their existence in the market for some time more. For the nonce, ASRock has elaborated a new micro-ATX motherboard, codenamed H61M-VG4. The newly-designed product is based on Intel H61 Express chipset with Socket LGA1155, supporting Intel Ivy Bridge/Sandy Bridge processor lines. According to ASRock, all potential customers will be able to receive quite efficient system for a budget price.



ASRock H61M-VG4 is furnished with two DIMM slots which support two-channel DDR3 memory modules of up to 16 GB capacity, running at 1066 MHz, 1333 MHz and 1600 MHz frequencies. Expansion facilities are realized by means of a single PCI Express 3.0 x16 slot and a single PCI Express 2.0 x1 slot. The connection of optical, hard and solid-state drives becomes possible thanks to the availability of four SATA …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.



New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.


Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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