Xigmatek to Release Dark Knight II CPU Cooler

Xigmatek, a multi-profile Taiwanese company, is about to launch its second version of Dark Knight CPU cooler – the SD1483. Featuring 120x50x159 mm dimensions, this tower-like device comes in two color variations: black and white (Frostbourne). The model supports processors with the utmost TDP level of 160 W, designated for AMD AM2/AM3/K8 & Intel LGA 775/1155/1156/2011 platforms.

Xigmatek Dark Knight II SD1483 consists of a small-sized heatsink with fifty-five aluminum thin fins; the latter boasts ceramic coating that is called to enhance heat dissipation area. The heatsink is pierced by three 8 mm heatpipes which support direct contact technology.

The framework also accommodates a single 140 mm fan, based on slide bearing. It is estimated for 150.000 hours of foolproof operation. The integration of PWM technology enables the variation of rotational speed from 800 RPM to 1200 RPM. The blades produce up to 90.3 CFM airflow at the maximum 18 dB noise level. According to the …

Spire Launches Ridge 6601 and Ridge 6602 PC Chassis

Spire has officially launched a new line of budgetary PC chassis, codenamed Spire Ridge. At the moment, there are only two models within the series – the Ridge 6601 and the Ridge 6602. Both are characterized by the support for ATX motherboards and have many other identical specifications: i.e. mid-tower form-factor, 192x415x418 mm dimensions. Still, there are some differentiations as well.

The first distinction between the two models lies in the frontal panel design. Therefore, Ridge 6601 features a laconic panel made of plastic without additional ventilation. In its turn, Ridge 6602 features a half-perforated metallic frontal panel that allows for a more intense cooling of internal components.

The couple boasts identical expansion facilities with two 5.25-inch buckets for optical drives, four 3.5-inch buckets for HDD/SSD, and seven expansion slots. Connectivity options are introduced by a set of frontal interfaces, including two audio slots, one USB 2.0, and one USB …

AMD Highlights Plans for the Transition to the 28nm Process

AMD is a company known for the continual and elaborate work on the development and improvement of all product lines, as well as technological standards. Thus, the coming 2013 year is supposed to be portentous for the company in terms of the implementation of 28nm standards in their APU. AMD has recently voiced the plans for the change of the Trinity APU to a new model, codenamed Richland, and the transition to 28nm technological process.

The new APU, Richland, is presumably to be released in two versions: dual-core and quad-core. It will support a number of high-performance technologies, such as Blu-ray 3D, dual graphics, Open CL, AMD turbo core overclocking, and some others.

According to the preliminary information, Richland will employ FM2 socket (which Trinity employs) and Radeon 8000 series DirextX 11 GPU. This GPU will be furnished with 128 cores in dual-core model line, and with 384 cores in the high-end A10 APU. The same number of cores has been implemented in …
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