In times of headlong production, trade and service development, medium- and large-scale companies have to lock horns with their competitors in order to win the targeted customer groups. The increase of client base and business expansion comes to the limelight on such conditions. The struggle with competitors gets more constructive shape due to the software business opportunities which information technology provides. Oracle corporation, which established solid reputation in software development market, has recently released a new version of business loyalty program entitled Siebel Loyalty Management 8.2.2. This program is targeted at companies that make business on retail sale and issuance of financial, travel and telecommunication services.



Improved functional characteristics of Siebel Loyalty Management 8.2.2 are supposed to be its major advantage. Those characteristics allow the companies not only to increase the clientele, but also to retain the market positions. The …

Company Biostar, taking the example of the motherboard market leaders, manufactures the product for the audiophile — Biostar Hi-Fi Z77X. In the latest model are involved: the processor socket LGA1155, the flagship chipset for the platform (Intel Z77), three full-height PCI Express x16 and 13-channel subsystem of CPU power. The developer promises high quality audio through 7.1-channel HD Blue-ray audio codec ALC898, Technology THX TruStudio Pro, Hi-Fi Ground (multi-layer PCB with protectors properties), and Puro Tone (signal / noise ratio — 110 dB), as well as resistors, Hi-Fi Resistor with tin oxide capacitors and Hi-Fi Cap.



Four slots for memory with dual access are designed for installation of modules DDR3-1066/.../2600 totaling 32 GB. In addition, the construction of SLI and CrossFire configurations using the formula «x8 + x8» is possible. The lower slot PCI-E 2.0 x16 x4 is good to use for high-speed SSD-drives, and «external» controllers. PCB has six ports Serial ATA …

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …