Enermax Technology, an established Taiwanese developer of various PC hardware components, is about to announce its new roomy PC case within the boundaries of Fulmo series. Codenamed Fulmo ST, the case is designed in mid-tower form-factor and is distinguished by massy dimensions. Featuring 485x244x513 mm, the product’s weight approximates 8.2 kg. The novice will be available in two color variations: gray (ECA3270A-G-BL) and black (ECA3270A-B-BL).



Fulmo ST is ready to accommodate up to eight PCI expansion cards, three 5.25-inch drives and eight drives either of 3.5- or 2.5-inch standard. The case is compatible with ATX and micro-ATX motherboards, quite lengthy graphics cards (up to 412 mm if demounting the top HDD/SSD bay), as well as rather lengthy dual-heatsink for the water-cooling system (up to 280 mm). The latter might be replenished by ten fans of either 120 mm or 140 mm dimensional type.


Upon the whole, Enermax will deliver its Fulmo ST case with three …

ECS decided to tackle the problem of sameness, developing a new motherboard on the basis of Intel NM70 Express chips. The implementation exactly of these chips makes the board a pioneer in its product class. ECS NM70-I is designed in mini-ITX form factor and houses Intel Celeron 847/807 CPU. The latter consumes only 17W of power to add the board power-efficient properties. Such approach to layout secures a harmonious balance between performance parameters and price ranges, and is an ideal match for compact PC systems.



Irrespective of the initial motherboard's compact dimensions, the manufacturer stipulated expansion opportunities if the user finds such a need in future employment. The availability of 1x PCI Express slot x16, SATA 3Gb/sec and 6Gb/sec sockets promote for the unimpeded upgrade of video system and data storage devices. ECS NM70-I facilities allow the customer to play back high-contrast HD and Blue-Ray multimedia content. Moreover, ECS equips its board with two …

The rising competition between the two giants in the manufacture of processing units, Intel and AMD, makes each of the two invent ever newer technologies and implement them in their products. The attempts to dominate in the market and win as many consumers usually develop into brand new approaches and brand new advanced facilities.



In this light, Intel is going to upgrade its Ivy Bridge processors to make them more power-efficient. But power-efficiency does not imply that processing units will show less performance; quite the contrary, the manufacturer is willing to combine an utmost performance with the maximal power efficiency level.


Currently, the most power-saving processors of Ivy Bridge generation can be found in mobile devices on Windows platform and in Apple MacBook Air devices. Their TDP level is recorded at 17W. As appears from the above mentioned, the TDP level in upgraded Ivy Bridge processors will be lower than 17W, though the developers do not voice the margin …