Meet Two Modifications of Lian Li PC-V359 Chassis

Lian Li Industrial Co., a well-known Taiwanese designer of state-of-the-art PC cases, is glad to announce the release of two new versions of PC-V359 chassis. The first differentiation between the modifications lies in the color scheme: one model uses black-and-red scheme ($199), whereas the other one – pure golden scheme ($219).



Both chassis are made of aluminum alloy. Their frontal panel boasts the availability of a small window, while the top panel is entirely transparent. The latter is fixed by means of four screws, unscrewing of which enables the removal of frontal and side panels. This done, the user receives free access towards internal layout.


Lian Li PC-V359 cases are compatible with micro-ATX motherboards. They are ready to accommodate four PCI expansion cards, a thin ODD, six 3.5-inch and two 2.5-inch drives. The drives are fixed thanks to thumbscrews, replenished with rubber pads. If there is a need, it’s possible to remove HDD bays at all. Besides, the …

The Introduction of Transparent Chassis from Scythe

Scythe has recently amazed the community by the introduction of absolutely transparent chassis. ACB-Type3 model preserves the cutout of the standard Mid-Tower chassis solutions, but is made of transparent acrylic plates. One more peculiarity of this model is the parallel to the base localization of motherboard. Besides, ACB-Type3 is compatible with motherboards of various form-factor, including mini-ITX, micro-ATX, and ATX.



The motherboard is accommodated on a special tray. Right under this tray the customers are able to find a set of bays designated for the installation of PSU, three 3.5-inch drives, a couple of 2.5-inch drives, and three 5.25-inch drives. The chassis is compatible with CPU coolers of up to 190 mm in height.


At the same time, this model goes without any fans or side panels; this attributes the model to Open-Air segment. The product can content itself with practically noiseless passive system.


Scythe ACB-Type3 is equipped with sufficient number of …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Dell Inc. Dimension 4700 based on Dell Inc. 0M3918

  • CDROM
  • COMPUTER
  • DISKDRIVE
  • HDC
  • HIDCLASS
  • KEYBOARD
  • MEDIA
  • MOUSE
  • NET
  • PORTS
  • PROCESSOR
  • SYSTEM
  • USB
  • VOLUME